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(May 16, 2007) HERNDON, Va. and RENO, Nev. — iNEMI will hold its tin whisker workshop to review tin plating, tin whiskers, and reliability concerns May 29, 2007, at the Electronic Components and Technology Conference (ECTC) in Reno, Nev. The all-day workshop is co-sponsored by iNEMI, CPMT, and ECTC, and is open only to ECTC attendees.
The workshop will discuss tin plating — the preferred surface coating for component leads — and susceptibilities to needle-like protrusions (tin whiskers) that form and can cause serious performance problems, such as shorts. Knowledge surrounding tin whiskers has increased significantly since the first iNEMI workshop in 2004, said Ron Gedney, co-chair of the workshop and iNEMI consultant. He adds that the unknown still outweighs the known, particularly in the high-reliability realm and long-term studies. Maureen Williams, mechanical engineer at NIST, will co-chair; and Carol Handwerker, Ph.D., professor of materials engineering, Purdue University, will moderate.
Topics cover practical data on temperature and humidity's effects on whisker formation, industry data collected from manufacturing environments, materials considerations, stress measurements in tin films and whether stress affects whisker generation, tools and methodologies for measurements, mitigation recommendations with a focus on conformal coatings, and developments in the effort to define a unified theory regarding whisker formation.
To learn more or register for the event, visit the iNEMI Website, the ECTC page, or SMT's Events page.
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