Cookson's photovoltaic offering; PV cell with conductive inks and plating chemistry
(August 24, 2007) MILANO, Italy — The 22nd European Photovoltaic Solar Energy Conference, September 3–7 in Milano, will feature an increased presence of electronics materials companies launching products targeting the photovoltaics market. Following are the introductions Cookson and Indium plan for the show.
Cookson Electronics Assembly Materials (CEAM) and Enthone, Cookson Electronics business units, will exhibit plating chemistries, conductive inks, stencils, solders, and other materials and tool sets for the photovoltaic sector. Alpha introductions include the n:1000-IJ and -SP silver conductors for high conductivity in ink jet and screen printing production, respectively. The Alpha brand also will launch electroformed stencils for fine-pitch metallization lines, flux-coated PV-5000 Ready Ribbon and PV-Ready Exactalloy flux-coated solder preforms for photovoltaic-module assembly. Cookson will offer a range of flux and no-clean solder paste products at the exhibition, including tin/lead and lead-free offerings. Enthone's PV Heliofab DPC and ELSP plating chemistries will launch, targeting silver paste or silicon applications.
Indium Corporation also will launch materials and chemistries at the show, penetrating crystalline-silicon solar cell assembly as well as thin-film solder cell manufacture. The company is launching OnSpec CIG sputtering targets, metallization pastes for thin film, and metallization pastes targeting crystalline silicon. Indium also will feature solders, fluxes, indium and gallium chemistries, evaporation sources, and tabbing ribbon for the photovoltaic industry.
To learn more about the European Photovoltaic Solar Energy Conference, visit the conference Website, or see our Events page.
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Indium's OnSpec
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