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A sample PCBA from EI Shenzhen
(September 28, 2007) ENDICOTT, N.Y. and SHENZHEN, China — Endicott Interconnect Technologies (EI) began production of high-volume/lower-cost, fully assembled PCBs at its EI Shenzhen facility. The 40,000-sq.ft. production facility offers SMT assembly technologies, press fit, wave solder, selective pin thru-hole (PTH) solder, and hand assembly and soldering equipment.
EI's Endicott location will provide technical support for new product development and introduction (NPI), the customers can choose to ramp volume production at the EI Shenzhen site for most boards. EI will add capacity incrementally in China as-needed. EI Endicott will manage order placement, tracking, and invoicing, along with documentation and configuration controls.
The China-based facility can product high-density hybrid PCB assemblies (PCBAs), including double-sided, complex builds with mixed technologies and component counts about 1,500. Boards can be up to 457 × 610 mm. Component placement capabilities include high-I/O area-array components, such as BGAs/CGAs with 0.8-mm pitch and PBGAs; fine-pitch leaded components, down to 12 mils; and SMT discretes and chips down to 0402 form factors. High-density/high-I/O connectors, cages, chassis, and system assemblies also can be attached to the PCB. Target applications include server motherboards, communications PCBAs, and controller boards for medical and IT end products.
For more information, visit www.eitny.com.
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