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Stephen Brooks
(November 7, 2007) RESEARCH TRIANGLE PARK, N.C. — Nextreme appointed Stephen Brooks as director of manufacturing, citing prior experience with ramping technologies from introduction to volume manufacturing.
Brooks will coordinate Nextreme's move into a 14,000-sq.ft. facility, and will direct implementation of a scalable, repeatable volume manufacturing schema for its thermal copper pillar bump technology. Brooks offers more than 24 years experience in planning, establishing, and managing transition from R&D to volume manufacturing. As director of operations at Amkor Technology, Brooks led the company's ramp up to multimillion unit production/month flip-chip solder bumping, over a one-year period. He also held posts with JDS Uniphase (formerly Cronos Integrated Microsystems), and Mitsubishi Semiconductor's N.C. and Japan locations. He has overseen ISO 9001- and TL 9000-certified facilities in SMT, IC, wafer, MEMS, chip-scale package (CSP), and die-level production.
For more information, see www.nextreme.com.
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