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(December 10, 2007) PALO ALTO, Calif. — Frost & Sullivan released an analysis of pick-and-place, "Emerging Trends in SMD Placement," highlighting accuracy and modularity as key to next-generation pick-and-place systems. The report is part of the "Surface Mount Technology Technical Insights Growth Partnership" program.
Market and product demands created a smaller, lighter modern PCB, capable of carrying more components than previous iterations, according to Krishnakumar Srinivasan, Technical Insights research analyst. New component placement systems meet this change with faster placement rates and higher accuracies. These result from improved vision systems, servo systems, feeder design, fixating systems, software, and nozzle design, Srinivasan adds.
Modular designs are gaining importance due to an increased mix of SMD types and packages. This rise in variation impacts head technology, line balancing, optimization, and vision systems, the report notes. Hybrid placement machines also can address high product mix, and streamline changeovers.
Frost & Sullivan asserts that the component-placement industry is scrutinizing other aspects of surface mount technology, like solder material, packages, and conveyor systems, which all can impact the development curve of advanced SMD placement technology.
For more information, visit www.frost.com.
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