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One of the most important areas of electronic assembly, under reuse, recycle, and recall pressures, and tight margins, is rework and repair. In the transition to RoHS compliance, most assemblers find lead-free rework to be the least feasible, most costly step. Moderated by R. Wayne Johnson, Auburn University and Advanced Packaging Editorial Advisory Board member, the "Repair and Rework" technical presentation at APEX, April 1, promises to provide insight into lead-free rework.
If every board that entered the front end of the assembly line turned out fully functional and 100% defect-free, repair would not be necessary. In reality, this is not the case. And with the lead-free assembly environment, repair is even more complicated than in the days of tin/lead eutectic solder. This session features William Coleman, Photo Stencil, and SMT Editorial Advisory Board member, speaking about BGA and QFN repair; John Vivari, EFD Inc., Solder Paste Group, discussing hand soldering operations; and Jasbir Bath, Flextronics International, who will present "INEMI Rework Machine Temperature Tolerance and Repeatability Study."
For more information on the technical conference or about APEX, visit www.goipcshows.org.
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