SMT - February Featured Products

Following are the latest releases in thermal profiling, solders and fluxes, thermal management, components, digital microscopy, lead-free, and more from SEHO and KIC; IMS; Cobar BV, FCT Solder, and Nihon Superior; MIS; Master Bond; Koki and Christopher Associates; Qtek; and AVX.

Integrated Thermal Profiling
SEHO reflow ovens feature an additional communications software capability, co-developed with KIC, that allows reflow operators access to process traceability and monitoring. The KIC 24/7 product in the ovens is programmed faster because it reads the current SEHO oven configuration and set points and automatically downloads an optimized recipe. It helps prevent errors from manual input. Alarms can be set with SEHO's software to alert operators of out-of-spec profiles. It also enables automatic loading of correct KIC 24/7 programs once SEHO oven recipes are selected for a new production run with continuous process monitoring. Optional features include automatic profiling, CPK charts, traceability, and troubleshooting. KIC, San Diego, Calif., www.kicthermal.com.

Thermal Management Device
The B-Series Therma-Bridge is designed for simplicity and cost-effectiveness. It uses a thermally conductive aluminum-nitride chip with metalized terminals to transport heat from one location to another. The devices are available in various sizes and thicknesses to suit various board designs, thermal conductivity needs, and other metrics. International Manufacturing Services, Inc., Portsmouth, R.I., www.ims-resistors.com.

Lead-free Paste
XF3 lead-free solder paste joins the Cobar product family based on Nihon Superior's SN100C solder alloy. The paste targets extended reflow profiles run without nitrogen. Wetting on common metal surfaces is said to be excellent, and it produces shiny solder joints. The paste helps eliminate voiding. It is designed for 150–200 mm/sec. printing, with a robust window. The SN100C alloy reportedly demonstrates long-term fatigue strength, without any silver content. Cobar BV, member of the Balver Zinn Group, Breda, Holland, www.cobar.com.

Thermal-cycle-resistant Potting Compound
Master Bond EP30FL is a flexible epoxy potting and encapsulation compound designed for use in environments with thermal cycling, mechanical shock, and vibration. It is low viscosity, applicable in thick or thin cross-sections. It adheres to similar and dissimilar substrates. The formula is 100% reactive with no volatiles. It cures at room temperature with low exotherm and shrinkage. It is said to demonstrate resistance to water, and provide electrical insulation when cured. Master Bond Inc., Hackensack, N.J., www.masterbond.com.

High-activity Flux
For thru-hole and mixed-technology PCBs, NC162 SN100C no-clean flux is high activity, with no halides. It is lead-free compatible. The third-generation liquid flux reportedly minimizes post-processing residues, particularly in palletized processes. The alloy becomes more robust in high-temperature applications. Suited to use with SN100C Sn/Cu/Ni+Ge lead-free solder, it can be sprayed, foamed, or dipped in processing. FCT Solder, Greeley, Colo., www.fctassembly.com. FCT Solder, a division of FCT Assembly, is an authorized licensee of Nihon Superior's SN100C product line.

No-clean Paste
The S3X48 Series is a halide-free no-clean lead-free solder paste line developed for BGA and chipscale package (CSP) devices. Designed for fine-pitch, it also suits a range of other lead-free applications, according to the company. Benefits are said to be rapid wetting, a wide process window, printability, and a six-month shelf life. The paste is designed to perform at high reflow temperatures. It can help eliminate pillow defects on BGAs and CSPs. Koki Company Ltd., Tokyo, Japan; distributed by Christopher Associates Inc., Santa Ana, Calif., www.christopherweb.com.

Flux Dispensers
The QTEK Fluid Dispenser Pen suits solvents, lubricants, masking, RMA chemistries, adhesives, and water-based liquids. It is chemically designed to avoid reactions to alcohols and solvents. The pen is ESD-safe. It includes a nylon brush tip to control the flow of flux onto a soldering area. Dispensing Bottles are available in 2-oz. capacity for holding larger quantities and serving the same requirements as Pens. Bottles use 2.5-cm-long capillary needles with 0.25- or 0.50-cm internal diameters. Qtek Manufacturing Limited, Galway, Ireland, www.qtek.com.

Thru-hole Mil & Aerospace Components
MIL-PRF-123 series components — CKS05 and 06 molded radial components and CKS11, 12, 14, 15, and 16 molded axial products — feature improved capacitance values, higher voltages, and new tolerances. Capacitance ranges from 1 pf in axial leads to 0.47 uf in radial leads. Voltages range from 50 to 200 V in both configurations. The thru-hole devices suit military and aerospace assemblies. AVX Corporation, Myrtle Beach, S.C., www.avx.com.

Digital Microscope Camera
With a CCD sensor to enhance low-light image capture, the PAXcam2+ digital microscope camera suits polarized light, darkfield, and other microscopy applications in microelectronics, semiconductor, LCD display, and materials development and manufacture. It features an enhanced dynamic range for more accurate color and tonal reproduction. The camera also uses PAXit! imaging software. It offers external mount for macro applications, continuous white balance function, and USB-2 connection. MIS Inc., Villa Park, Ill., www.paxit.com.

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