|
SMTA announced its Toronto Academy docket; IPC details environmental concerns at APEX, and looks ahead to IPC Midwest; iNEMI plans forums and presentations at APEX.
The SMTA Toronto Academy, March 26–27, will occur in conjunction with the Advanced Manufacturing Expo. Courses include "The Deadly Sins of SMT Assembly," "Advanced SMT Manufacturing — Equipment, Processes, and Practices," and "SMT Process Fundamentals for Tin/lead and Lead-free Assembly." SMTA also will host its SMT Certification Program. For more information, visit www.smta.org, or contact Melissa Serres at (952) 920-7682; melissa@smta.org.
IPC — Association Connecting Electronics Industries plans to highlight environmental, health, and safety (EHS) activities during this year's IPC Printed Circuits Expo/APEX/Designers Summit, March 31 to April 3 in Las Vegas. The association will use standards development meetings, technical sessions, and professional development courses to inform the industry on impending restrictions affecting PCB and electronics manufacture. Content covers China RoHS, REACH, material content declarations (MCDs), and the CSAT-Top Screen chemical security assessment tool. For more about APEX, visit www.goipcshows.org.
IPC also lauded the return of IPC Midwest Conference and Exhibition this year, scheduled for September 24–25 in Schaumburg, Ill. The exhibit hall will occupy 27,500 sq.ft., with about 75 exhibitors on board thus far. IPC notes that the exhibitor roster includes new and returning companies. The show is expected to host more than 1,200 participants at standards meetings, technical sessions, and professional development courses. For more information, see www.ipcmidwestshow.org.
The International Electronics Manufacturing Initiative (iNEMI) will highlight four projects at APEX in Las Vegas. The iNEMI Lead-Free Forum on April 1 will review Phase I results of iNEMI's "Lead-free Wave Soldering Project" and final results from the recently completed "Lead-free BGAs in Tin/lead Assemblies Project." This session is free for anyone attending the exhibition. Jasbir Bath, Flextronics International, chair of iNEMI's "Lead-free Rework Optimization Project," will present "iNEMI Rework Machine Temperature Tolerance and Repeatability Study" also on the 1st. "Lead-free BGAs in Tin/lead" project chair Robert Kinyanjui, Sanmina-SCI will present "Solder Joint Reliability of Lead-free SnAgCu BGA Components in Tin/lead Assembly Process" on April 2. Finally, the iNEMI "Halogen-Free Project" team will hold an open meeting on April 2. The initial Halogen-Free Project has been developing guidelines for standardized materials, manufacturing, assembly, and test for halogen-free printed wiring boards (PWBs) based on market segment requirements and technical, commercial, and functional viability. This meeting will discuss and develop plans for future iNEMI halogen-free activities. For more information, visit www.inemi.org.
|
Current Issue 
Add RSS Feed
