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(February 19, 2008) DALLAS — The SMTA Dallas Vendor Days and Technical Conference, March 5, 2008, at the Richardson Civic Center outside Dallas, promises a full exhibit hall along with several key technical presentations covering advanced packaging, counterfeit components, and related topics.
Charles Cohn, TechSearch International, Inc., will keynote. His presentation will review trends in substrates for advanced packaging. Other conference speakers include Susan Bagen, Endicott Interconnect Technologies, Inc., with "System-in-package (SiP) Options for Electronics Miniaturization;" and Art Ogg, World Micro, Inc., with a talk titled "Counterfeit & Rework Abatement Programs in the Electronic Components Industry."
Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., will be showcasing its SN100C products with FCT Assembly, one of its U.S.-based SN100C global partners. Along with various products based on the SN100C silver-free lead-free alloy, Nihon Superior also offers SN100C no-clean ePaste for general reflow purposes. Other exhibitors at the Dallas show include Aqueous Technologies, Asymtek, Austin Semiconductor, Bare Board Group, Coretec, Dage Precision Industries, DDi, DEK USA Logistics, Endicott Interconnect, GPD Global, Henkel Technologies, InLine SMT, Kyzen Corporation, Micro Care Corporation, Micropac Industries, OK International, Seika Machinery, Smart Splice, SMEC, Systronix, and Yestech.
For more information, visit www.smta.org.
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