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Nihon Presents on Lead-free at APEX

(February 26, 2008) OSAKA, Japan — Nihon Superior Co. Ltd. is contributing a paper, "Properties that are Important in a Lead-free Solder," to the technical conference at IPC Printed Circuit Expo/APEX/Designers Summit, April 1–3, 2008, in Las Vegas.

The paper will be presented by Keith Sweatman, senior technical advisor, in the session "Solder Alloys," on April 2. Nihon Superior reports that it will share its experience in identifying properties relevant to the performance of an alloy as a reliable, user-friendly, and cost-effective lead-free solder.

For more solder presentations at APEX, read our conference preview.

Nihon Superior will exhibit at Booth 249. For more information, see www.nihonsuperior.co.jp.



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