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(March 25, 2008) LAS VEGAS — Technical presentations will take center stage at IPC Printed Circuits Expo/APEX/Designers Summit, April 1–3 in Las Vegas. Following are previews of select presentations taking place at the show, as well as links to other aspects of the technical program.
Soldering equipment manufacturer SEHO Systems is contributing a paper, "New Technology to Meet Challenging Reflow Requirements," presented by Christian Ott, senior sales and project manager, in the session Reflow Assembly on April 2. The presentation will provide an insight into the research project Microflow, funded by the German Federal Ministry of Education and Research. This project features a new technology combining convection reflow soldering and microwave heating in a simultaneous process. Target is a thermal release of the assemblies by means of selective heating with electromagnetic waves, which allows the solder paste deposit to be heated stronger and faster than the temperature-sensitive components and substrates. SEHO will exhibit at Booth 1677. For more information, see www.seho.de.
Kyzen Corporation chief technology officer (CTO) Mike Bixenman will co-host the Cleaning & Alternatives Subcommittee with William Kenyon, Ph.D., Global Centre for Process Change Inc., on March 31. This subcommittee is combining and updating four cleaning handbooks into a single document. This work is just beginning; additional suppliers and users of cleaning mediums and equipment are invited to participate. The base documents are IPC-SC-60, "Post Solder Solvent Cleaning Handbook;" IPC-SA-61, "Post Solder Semi-Aqueous Cleaning;" IPC-AC-62, "Aqueous Post Solder Cleaning Handbook;" and IPC-CH-65, "Guidelines for Cleaning of Printed Boards and Assemblies." To learn more, visit www.kyzen.com, or visit Booth 2219.
For more of APEX technical presentations, see
Nihon Presents on Lead-free at APEX,
APEX Preview: Focus on Solder,
APEX Preview: Rework Course,
APEX 2008 Preview: Technical Sessions,
or visit www.goipcshows.org.
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