Unimicron's Taiwan-based facility will manufacture EI's CoreEZ organic substrates.
(March 28, 2008) ENDICOTT, N.Y. — Endicott Interconnect Technologies Inc. (EI) entered into a sales and manufacturing agreement with Unimicron Technology Corp. to produce CoreEZ organic substrates at one of Unimicron's Taiwan facilities. The PCB maker will supply high volumes of CoreEZ products under EI specs and requirements.
Under terms of the agreement, original design manufacturer (ODM) EI maintains control of the design and technical support worldwide for the CoreEZ product line. Unimicron will be the high-volume manufacturer, and sales of CoreEZ product will be jointly handled by the two companies.
Unimicron's sales and marketing infrastructure, skilled workforce, and facilities were the draw for EI in outsourcing high-volume substrate manufacturing, said Michael J. Hills, senior VP sales, marketing, and business development at EI. He expects more design wins and new product introduction (NPI) activity with the additional of low-cost manufacturing abilities. EI began producing complex PCBs in a Shenzhen, China, facility late in 2007 for similar reasons. To learn more, read EI Opens Shenzhen Manufacturing.
CoreEZ organic substrates offer a dense, thin-core, build-up flip chip technology that combines electrical, reliability, and wireability performance with a reportedly cost-effective material set. It suits high-speed graphics and microprocessor applications.
For more information, visit www.unimicron.com and www.endicottinterconnect.com.
|
Current Issue 
Add RSS Feed
