Masthead Corporate Logo
Subscribe eNewsletter Magazines

Surface Mount Technology Online Article

| Add RSS Feed

SMT China Hosts 2ndVISION Awards

(April 10, 2008) SHANGHAI, China — "China, the world's biggest electronic manufacturing center, despite the competition from neighborhood countries, the appreciation of the RMB, the tightening of government regulations; the country's GDP is still growing at double digits. More and more international and domestic SMT equipment, materials, and service providers are entering into the market," said Adonis Mak, group publisher, SMT China, during the magazine's presentation of its second annual VISION awards at Nepcon China. Winners received honors in SMT equipment, excellence in a specific metric, and China-centric awards. Following are the winners.

Printing: Speedline Technologies Asia Pte Ltd., MPM Momentum.
Dispensing Equipment: Asymtek, a Nordson company, with the Spectrum S-920.
Pick-and-place, high-speed: Siemens A&D EA China, SIPLACE X4i.
Pick-and-place, mid-speed: Juki Corp., FX3.
Pick-and-place, multi-function: Essemtec, CSM7100V.
Reflow Soldering: Heller, 1913MK III.
Wave Soldering: Speedline Technologies Asia Pte Ltd., ELECTROVERT DwellMax Plus.
Cleaning Equipment, post soldering: Aqueous Technologies, Trident.
Inspection & Testing, AOI: CyberOptics Corp., Flex ULTRA HR automated optical test/inspection system and Viscom, S3088-II.
Inspection & Testing, AXI: Agilent Technologies, Inc., Medalist x6000.
Inspection & Testing, ICT: Everett Charles Technologies, Gemini Spring Pin.
Rework & Repair: VJ Electronix Inc., Summit 2200 advanced rework station.
Hand Tools, soldering: OK International, MFR Series.
Assembly Tools: Inovaxe, INOCART MSD.
Process Control Tools: Electronic Controls Design Inc. (ECD), MEGAMO.L.E. 20 thermal profiler.
Device Programming: BPM Microsystems, Flashstream flash memory programmer family.
Software, process control: DEK International GmbH, Instinctiv V9 and KIC, KIC Explorer with Power Series.
Software, production: Juki Corp., OPASS.
Software, management: Valor Computerized Systems Ltd., vManage.
Soldering Materials: Indium Corporation, Indium8.9 and Nihon Superior/Balver-Zinn/DKL, SN100C.
Flux: Cookson Electronics Limited, ALPHA EF-2210 wave solder flux.
Encapsulants/Underfills: Henkel Loctite (China) Co. Ltd., Loctite 3536.
Cleaning Materials: Kyzen Corporation, AQUANOX A4625B.
Environmentally Friendly Product/Service: EVS International, EVS 1000 solder recovery system.
RoHS Testing & Services: RMD Instruments, Lead-Tracer RoHS

Excellence Awards
Creativeness & Innovativeness: DEK, Platium.
Performance: Fineline Stencil, Slic-Blade squeegee blades and Speedline Technologies Asia Pte Ltd., MPM Momentum.
Reliability: BTU International, Pyramax 100.
Cost-effectiveness: Juki Corp., FX3.
Ease of Use: Siemens A&D EA China, SIPLACE X4i.
Flexibility: Dage, Dage XD7500NT.
Compatibility: Siemens A&D EA China, SIPLACE X4i.
Quality Contribution: RMD Instruments, Lead-Tracer RoHS.
Environmental Responsibility: Valor Computerized Systems Ltd., vManage; Cookson Electronics Limited, ALPHA EF-2210 wave solder flux; and EVS International, EVS 1000 solder recovery system.
Maintainability/Reparability/Service: BTU International, Pyramax 100; Ovation Products, Magna-Print SMT squeegee system; and KIC, KIC Explorer with Power Series.

Chinese Achievement Awards went to ICON Technologies for its Icon i8 fully automatic screen printer and Aleader for the ALD-A-700.




| Add RSS Feed


 
Return to Previous Page

 
Webcasts

More

Sponsored White Papers Library
Recently Added White Papers

Conductive Film for RF Grounding Can Take the Heat (11/21/2008, Henkel Corporation)

New Corrosion-Resistant Conductive Adhesive for Consumer Applications Delivers Cost-efficient Alternative to Current Technologies (10/07/2008, Henkel Corporation)

Understanding Lead-Free Solder Joint Shear Performance (09/05/2008, Henkel Corporation)

Flux gets its FillNew Epoxy Flux Material Offers Underfill Protection (06/04/2008, Henkel Corporation)

More
Featured White Papers

Conductive Film for RF Grounding Can Take the Heat (11/21/2008)
 
Choosing the Right Solder Paste (05/20/2008)

More