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(April 14, 2008) ENDICOTT, N.Y. — The Center for Advanced Microelectronics Manufacturing (CAMM), located at the Endicott Interconnect Technologies Inc. facility in Endicott, was inaugurated in late March, in a ceremony attended by business, political and community leaders. A collaborative effort by Binghamton University, Endicott Interconnect Technologies and Cornell University, the CAMM will pioneer microelectronics manufacturing research and development in a roll-to-roll (R2R) format.
CAMM's R2R development efforts will result in flexible, rugged, lightweight electronic components and innovative products that will be critical to next-generation applications in areas such as military and homeland security, lighting, energy and power generation, displays, and product identification and tracking, assert CAMM representatives. The facility comprises 10,000 square feet and cleanroom space. It includes an integrated R2R flexible electronics prototype manufacturing line, and an associated microfabrication laboratory. CAMM facilities also include a precision lithography stepper, vacuum coaters, and an in-line defect inspection capability.
Plans for the CAMM were initiated in 2005 when the United States Display Consortium (USDC) selected Binghamton University to manage this new initiative. The USDC provided $12 million in equipment to establish the CAMM, which is hosted by Endicott Interconnect Technologies and draws collaborative resources from Cornell University. Mark Poliks, Ph.D., director of R&D at EI and technical director of the CAMM, hosted the inauguration event for CAMM.
Under Professor Bahgat Sammakia, director of Binghamton University's New York State Center of Excellence in Small-scale Systems Integration and Packaging Center, of which the CAMM is an integral component, and Poliks, the facility will evaluate equipment and materials developed under the auspices of USDC, industry, and its own R&D. The CAMM will also provide large-scale testing whereby academic and industrial research groups can test their work for manufacturing applicability without the high costs and risks typically associated with such activities.
Equipment is accessible to academia and private industry, which participates in the CAMM through paid membership and funded research programs. CAMM's corporate members include Endicott Interconnect Technologies, General Electric, Kodak, Corning Incorporated, Texas Instruments, Plastic Knowledge and Samsung Electronics Company. Additional partners and supporters include the National Aeronautics and Space Administration (NASA), the Army Research Laboratory, and New York State Foundation for Science, Technology, and Innovation.
For more information, visit www.endicottinterconnect.com.
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