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(April 15, 2008) WARWICK, R.I. — Cool Polymers Inc. introduced its next-generation thermally conductive injection-mold thermoplastics for heatsinks and thermal management solutions. The proprietary CoolPoly grades provide no antenna effect as metal heatsinks can, and are said to be up to 50% lighter than aluminum designs.
The E-series grades are electrically conductive and provide inherent EMI/RFI absorption. D-series grades are electrically insulative and produce no signal interference or magnetic coupling. The materials are available as compounds for injection molding, off-the-shelf parts molded from these polymers, or as custom-built parts. Applications include electrical and electronics, telecommunications, mobile products, medical imaging, appliance, automotive, controls and power products.
Benefits include no antenna effect, heat dissipation equivalent to aluminum, parts up to 50% lighter than aluminum, injection-molded with 3D complexity, simplified attachment, smaller and lower-cost product, shock and vibration resistance, thermal conductivity of 20 W/mk, thermal diffusivity of 0.1 cm2/sec., density of 1.7 g/cc. Mold shrinkage reportedly is minimal.
For more information, visit www.coolpolymers.com.
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