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(April 21, 2008) IRVINE, Calif. — Henkel launched its Loctite 5210 fast cure thixotropic silicone material for devices in harsh environments. With improved production throughput, operating temperature flexibility, and storage, Loctite 5210 offers a reportedly cost-effective alternative to traditional hot-melt glues or other silicones.
In control boards, connectors, automotive modules, construction equipment, and other high-stress assemblies, additional stability is required to avoid device damage or system failure. Common damage seen in these types of environments may include bent leads, non- functional components due to vibration, or material degradation, according to Henkel. The Loctite 5210 targets these sectors and offers automated and safe application. Unlike some hot-melt glues, which pose corrosion issues due to their high ionic content and can melt and flow away. Either of these conditions could result in device failure, Loctite 5210 is designed for use in electronics assemblies.
Loctite 5210 is a fast curing, non-corrosive, room-temperature vulcanization (RTV) silicone material. Dispense times can be as low as 31 sec. for two connectors. Tack free time is less than 5 minutes. Highly thixotropic, the material will hold its form upon dispense and will not spread or migrate to other locations.
For more information, visit www.henkel.com/electronics.
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