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(May 5, 2008) AESCH, Switzerland — Essemtec launched a batch manufacturing solution for customers producing sensor strips on flex PCBs with LED components. The production begins by screen printing the solder paste on an SP200 printer and then dispensing with a jet dispenser. Pick-and-place LEDs and UV curing of the adhesive occur on a FLX2010-based module. The next step is to laser solder the pads using a third-party laser soldering system.
The concept of the LED solution is based on the FLX2010, which is equipped with a movable vacuum table, UV chamber and dispensing unit with jet valve. The foil is placed on a carrier. The vacuum table and the carrier are then pressurized permanently. The movement of the table is software controlled and the GUI is customized for the application. The head unit is equipped with a jet valve and the pick-and-place Z axis. The vacuum pump is located outside of the machine and runs constantly. In the last few years, Essemtec has provided the LED industry with production equipment in various areas, most of which was manufactured by customer design, according to the company.
The target cycle time for most customers is 5.4 sec./sensor strip; Essemtec AG reportedly can achieve 4.1 sec./strip, resulting in a 34% production capacity increase. The sensor strips are based on a foil substrate consisting of up to 56 strips with three LED each. The process steps include dispensing adhesive with a jet dispensing unit, pick-and-place LED and curing the adhesive with UV light.
For more information, visit www.essemtec.com.
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