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(June 10, 2008) MANASSAS, Va. — A leading global contract manufacturer recently evaluated numerous cleaning agents to significantly improve its current stencil cleaning process. Upon an extended on-site cleaning evaluation, VIGON SC 200 was tested and confirmed to exceed the customer requirements.
ZESTRON's Application Technology Department assisted the customer to select a cleaning solution that would overcome their current limitations. While using the previously implemented cleaning agent, concerns ranged from inconsistent cleaning results to poor stencil compatibility and reduced bath life. Due to VIGON SC 200's product behavior, the usage and evaporation were reduced significantly. Furthermore, the customer was able to eliminate frequent bath changes, which contributed to the overall cost savings.
VIGON SC 200 is a water-based cleaning agent designed to reliably remove solder pastes and SMT adhesives in one single process and is also approved to be used for stencil underside wiping in printers. Based on its MPC Technology, the cleaning agent offers high bath loading capability, good filterability, and a long bath life as well as low maintenance costs. It is designed for use in spray-in-air and ultrasonic cleaning systems and is recommended for cleaning of misprinted boards as well. Due to its mild formula, the medium was confirmed to be compatible with stencils from leading stencil manufacturers.
For more information, visit www.zestron.com.
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