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(October 7, 2008) AUSTIN, Texas — The growth of flip chip and wafer-level packaging (WLP) is a bright spot in the electronics industry, according to TechSearch International's recently released study, "2008 Flip Chip and WLP Market Trends and Forecasts." The study projects a compound growth rate of more than 14% for flip chip units and 14% for WLPs between 2007 and 2012.
The drivers for flip chip continue to be performance and form factor. The use of flip chip for a variety of wireless products will contribute to the growth in 2009. An increasing number of suppliers of ASICs, field programmable gate arrays (FPGAs), DSPs, chipsets, graphics, and microprocessors are expanding their use of flip chip with solder bumps and copper pillars in package (FCIP). Flip chip on board (FCOB) continues to be found in automotive electronics, hard disk drives, and watch modules. Many companies are planning to use micro bumps for future through silicon via (TSV) products.
The growth in WLPs is driven by increased demand for thinner, lighter portable products, but WLPs are adopted for both form factor and performance reasons, TechSearch reports. WLPs typically have been used for low-pin-count (50 I/Os and fewer) small-die-size applications, including analog devices such as power amplifiers and battery management devices, MOSFETs, image sensors, controllers, and integrated passives. However, WLPs now are an option for larger die sizes with higher pin counts (100 I/O and more). The TechSearch study details these developments, including the trends in fan-out WLPs, with descriptions and photos.
Gold bump demand continues to be dominated by LCD driver ICs, but die shrink has limited the growth in number of wafers. An increasing number of gold stud bumped devices are also shipping.
The study provides an updated forecast for the flip chip wafer bumping market by product application, device type, FCIP/FCOB split, number of wafers, and number of die. Projected demand and capacity (merchant and captive) by the number of wafers and bump type are also included. Geographic changes in the location of bumping supply are analyzed. WLP demand is projected in number of die, number of wafers, and device type. Capacity is stated in number of wafers. Suppliers of bumping, wafer level packaging, mounting equipment, and contract assembly service are described. Contacts for these companies as well as for suppliers of laminate substrates, laser dicing equipment, and inspection systems are provided.
For more information, visit www.techsearchinc.com.
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