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(November 3, 2008) GREELEY, Colo. — Genesis Materials Technology (GMT) improved the ENIG resistance of Florida CirTech's water-based AQ2000 LPI solder mask. AQ2000 LPI now is able to withstand the harsh chemical conditions found in the ENIG process. Florida CirTech additionally released a catalyst killer, CK300, to minimize skip and background plating during ENIG processing.
GMT manufacturers a patented VOC-free waterborne liquid photoresist and liquid photoimageable (LPI) solder mask and legend inks with no organic solvents. AQ2000 LPI is completely water-based and contains no solvents and no VOCs. The photo speed of AQ2000 LPI remains high, which shortens exposure time and increases throughput. Beta site testing has begun. For more information, visit www.genesismt.com.
Florida CirTech also debuted its proprietary CK300 - Catalyst Killer. CK300 removes residual palladium left over from the electroless copper process. Additionally, it eliminates ENIG plating in non-plated thru-holes.
For more information, visit www.floridacirtech.com.
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