SMT - November New Product Showcase

New products released to the SMT assembly market include pressure-indicating films for adhesive applications, components and off-the-shelf modules, MSD moisture-control cabinets, final assembly components, XRF systems, programming software for automated tools, soldering system controls, automated programmers, rework systems, and test analysis systems.

Pressure-indicating Film
Pressurex Zero tactile pressure-indicating sensor film characterizes contact surface pressure from 7.2 to 28 PSI (0.5 to 1.97 kg/cm²). The flexible film is placed between contacting or mating surfaces to instantly and accurately measure and map pressure magnitude and distribution. Variations in contact surface pressure are visible by the impression made on the film. Pressurex is available in a thin clear plastic sheet (4 or 8 mil), physically similar in appearance to paper. When placed between contacting surfaces, it instantaneously and permanently changes color directly proportional to the actual pressure applied. Pressurex is used in the design, manufacture, calibration, and quality control of many products, including heat sinks, circuit board lamination, adjustment of squeeze pressure distribution of solder cream against PCBs, LCD panel display assembly, biomechanics, press rollers, heat seals for packaging, squeegees, and others. Pressurex conforms to curved spaces and tight designs. It suits invasive, intolerant environments not accessible to conventional electronic transducers. Sensor Products Inc., www.sensorprod.com.

0603 Attenuator
A 63-mW 0603-size thin-film attenuator joins the A-Series attenuators in 0402, 0603, 0805, 1206 and 1612 sizes with dB values from –0 db to –10 dB. These 'Pi' attenuators feature a low VSWR of 1.3:1 and a thin film attenuation element operating in the DC – 10 GHz range. RoHS-compliant 100% tin terminations with a nickel barrier layer enhance solderability and mechanical integrity. The A-Series has a 50-piece MOQ for bulk and 1,000-piece MOQ for tape and reel. International Manufacturing Services Inc. (IMS), www.ims-resistors.com.

Totech's XSD 702
MSD Control Cabinet
This moisture sensitive device (MSD) handling process reportedly is proven to dry components at accelerated rates, without the oxidation problems associated with traditional baking. Designed to exceed challenges of IPC J-STS-033B.1 for handling MSDs, the Model XSD 702 complements its predecessor XSD 1404. MSL 5, 1.4-mm components can be completely dried in 24 hours. All Super Dry products deploy self-regenerating desiccant. A U-5000 Zeolite drying unit in the XSD Series achieves humidity levels of under 0.5% relative humidity (RH), along with an integrated precision heating system. Temperatures used are relatively low, so taped reels can be effectively dried without damage to the tape. The XSD Series cabinets are heavily insulated, consume a fraction of the energy of baking ovens, and are equipped with a host of additional features including precision measurement, 24/7 data logging, and a touchscreen operator interface. Totech Super Dry, www.superdry.info.

Embedded Wi-Fi Networking Module
Designed for OEMs, the advanced 802.11b/g embedded Airborne Wireless Device Server Module is an enterprise-class Wi-Fi networking module. It provides WPA2-enterprise class extensible authentication protocols (EAP) with support for authentication certificates. The module provides wireless serial device server or Ethernet-to-wireless bridge functionality and is designed to meet extended operating temperature ranges. It supports delivery of certificates to the module and manages all authentication processes without requiring interaction from the host. Advanced security technology enables use in healthcare, industrial control and automation, retail, and transportation end-products. The Airborne Enterprise Class Module combines the 802.11b/g Wi-Fi radio with a 32 bit ARM9 microprocessor,. The Airborne Wi-Fi Networking Module incorporates a fully integrated device server, serial bridge, and TCP/IP network stacks. High-reliability, the module's integrated 10/100 Ethernet PHY increases throughput in embedded Ethernet-to-Wireless applications. It supports network address translation (NAT) 3.0. Quatech Inc., www.quatech.com.

Bluetooth modules from Laird.
Bluetooth Modules for Embedded Designs
These four new Bluetooth modules incorporate Bluetooth stacks and are pre-approved to minimize the design effort in implementing short-range wireless. The BTM410 is designed for data applications and is a fully integrated, sub-miniature Bluetooth data-oriented module based on Cambridge Silicon Radio's BC04 chipset. It provides a UART interface and a comprehensive AT command set to allow an easy interface to a host processor. Targeting systems running an embedded operating system with its own Bluetooth stack, the BTM420 module range uses the same sub-miniature format, but supports an HCI interface and is pre-approved as a Bluetooth controller subsystem. Ideal for audio and multimedia applications, the BTM510 module supports headset applications and is based on Cambridge Silicon Radio's BC05 chipset with integrated DSP. The BTM510 includes a full Bluetooth stack with built-in support for A2DP, AVRCP, HFP, and HSP profiles. An AT command set, enhanced for multimedia applications, provides simple control, including the ability to map local switch functionality to a range of I/O pins. For power multimedia applications, the BTM520 series offers a high-gain, multilayer ceramic antenna that provides +10 dBm output. The modules target ease of integration, allowing designers to replace cables with a wireless link. All are based on Bluetooth standard Version 2.1+EDR, and are designed for high reliability with an industrial operating temperature range of -30° to +70°C. Development kits and tools come with the wireless modules. Laird Technologies, www.lairdtech.com.

XRF for WEEE/RoHS Applications
A line of XRF tools targets compliance testing and prohibited-metals monitoring for EU directives. The benchtop XRF systems provide non-destructive measurement of total lead, mercury, chromium, bromine, and cadmium in most materials and allow for lead content quantification for reverse RoHS applications requiring 2–5 % minimum lead content. Matrix also offers certified reference standards that can be used for tool audit and measurement integrity management. The XRF tools can measure standard circuit and packaging applications including Au/Ni/Cu; immersion coatings of Au, Ag, and Sn; matte Sn; Sn/Pb on leads, pads, and bumps; and ENIG stacks. XRF spectrometers can be configured with gas-proportional, Si-PIN, or silicon drift detectors and primary beam filtration to provide rapid, non-destructive verification. Mechanical or optical X-ray beam collimation in conjunction with video camera alignment allows confirmation of specific analysis areas and features. Matrix Metrologies, www.matrixmetrologies.com.

Left-hand Ball Screws
An expanded line of precision-grade ball screws suits use in machine and assembly positioning stations. The left-handed thread style, Series BSL, is available in four sizes, with thread diameters of 8, 10, 12, and 15 mm with corresponding leads of 2, 4, 5, and 10 mm. The units are built from induction-hardened and carburized steel, in lengths from 100 to 895 mm, configurable in 1 mm increments. All are fully RoHS compliant. Series BSL left-handed thread ball screws offer various machined end and key groove options. Three grease options accommodate various uses. Misumi USA Inc., www.misumiusa.com.

Robotics Software
WINCAPS III off-line programming software saves development time by enabling users to program a robot on an off-line computer, without the robot having to be in operation. A 3D simulation feature enables layout of the automation work cell in a virtual environment. CAD drawings can be imported in standard VRML and DirectX formats, and variables can be input or changed easily. Users can verify reach, determine obstacle clearances, detect collisions, troubleshoot and debug programs, and determine cycle time. The software also allows remote monitoring of work cell operations via real-time I/O status indicators and detailed control logs. A panel design feature allows customization of the robot controller's teaching-pendant display. DENSO Robotics, www.densorobotics.com.

SMT connectors from Molex.
Flex Connectors
A 0.25-mm-pitch SMT ZIF (zero insertion force) FPC connector is designed to save up to 40% of space compared to similar 0.30-mm-pitch connectors for applications in cell phones and other mobile devices. This connector targets smallest height, depth, and length dimensions. Available from 21 to 39 circuits, SMT ZIF connectors include spring features on the terminals for secure electrical contact even if the cable is pulled up or down after actuation. The terminal design also provides full ZIF functionality, providing protection against wear or damage to the FPC contact pads. The front flip Easy-On actuator offers easy cable access and strong cable retention. An actuator-to-housing friction lock provides additional cable retention and an audible click when mating. The 0.25-mm-pitch cable has a similar layout and tolerances as 0.30-mm-pitch cable, which makes it more economical and easier to source than 0.20-mm-pitch cable. The SMT ZIF bottom-contact series is rated at 0.2 A and 50 V. It includes a large open area where the cable is inserted. The housing design also features a flat, open area to accommodate pick-and-place equipment. Front solder tabs under the housing provide space savings, stability, and strain relief for SMT solder joints. Molex Incorporated, www.molex.com.

Chip Resistors
The HGC Series of precision thick-film high-resistance value chip resistors is optimized for precision high-resistance values at a lower cost. Applications include voltage dividers for test instruments, meters, and monitoring equipment; voltage regulation modules and circuitry; as well as gas detection, and liquid and airflow metering. It uses a proprietary method of depositing the thick-film resistance material on the ceramic substrate. This process yields a resistance element that is more stable, less noisy, and capable of better resistance values. Lower ohmic value inks are much more readily available and are inherently more stable than the same ink in a higher ohmic value. The HGC Series is available in sizes from 0402 up to 2512 and values from 1K up to 2 Teraohms. Tolerances provided by this series range from 20% down to 0.25% and TCRs range from 200 down to 25 ppm. Tighter tolerances and lower TCRs are also possible for certain values. This series also has low VCR characteristics of less than 1 ppm per volt. The HGC Series is available in standard tape and reel packaging on 7" reels. Stackpole Electronics Inc., www.seielect.com.

Test-coverage Analysis Tools
TestWay Express next-generation test coverage analysis tool reportedly is easy to use. It can measure the coverage provided by a combination of the various testers used in the electronics industry, and provide an independent coverage analysis on board designs. TestWay Express is built around TestWay DfT analysis and test coverage analysis tool. TestWay Express will analyze the number of defects detected at each stage in the test process and identify any shortfall in test coverage, and undetected defects. QuadView-TPQR allows users to independently compute the test coverage provided by a single piece of test equipment. It is built around the QuadView layout and schematic viewer, allows users to visualize coverage at both device and pin level for any test/inspection systems. Importing the test equipment program or coverage report, QuadView-TPQR analyzes the data and computes the coverage, presenting results as a report and visualized within the layout and schematic views. ASTER Technologies, www.aster-technologies.com.

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