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November Book-to-Bill Continues Downward Slope
(December 22, 2006) BANNOCKBURN, Ill. — The November book-to-bill fell to 0.92 for North American rigid- and flex-PCB production, down slightly from 0.99 in October. The rigid segment posted a book-to-bill of 0.92; flex circuit production reached 0.86, both down from the previous month. The current decline indicates a period of slow growth in all segments of electronics, said Denny McGuirk, president of IPC, who predicts a strong year-end.
BiTS 2007 Program Fosters Networking
(December 19, 2006) MESA, Ariz. — The 8th annual Burn-in and Test Socket (BiTS) Workshop — March 11 – 14, 2007 in the Hilton Phoenix East of Mesa, Ariz. — issued an advance program with details on tutorials, keynotes, and presentations. BiTS EXPO runs concurrent with the workshop. Organizers stress that all activities, including receptions, extended breaks, and sessions, will promote informal discussion and networking.
A.C.E. Offers Nitrogen Generators
(December 19, 2006) SPOKANE, Wash. — A.C.E. Production Technologies, in partnership with On-Site Gas Systems, Inc., will offer On-Site nitrogen-generation systems under the A.C.E. brand, incorporating gas generators into the soldering products line.
China OEMs See Modest Revenue Growth
(December 18, 2006) EL SEGUNDO, Calif. — China's top 60 OEMs are expected to average revenue-growth at 13% in 2006, lower than the 34% experienced in 2005, due to a slowing market of international mergers and acquisitions. Domestic mergers and acquisitions will occur more frequently in the future, according to the "Market Watch: China" report by Byron Wu of iSuppli Corp.
iNEMI Updates Tin Whiskers Findings
(December 18, 2006) HERNDON, Va. — The International Electronics Manufacturing Initiative's (iNEMI) tin whisker user group updated its "Recommendations on Lead-free Finishes for Components Used in High-reliability Products," revising and adding recommendations.
Samsung Adds Reflow Soldering to Turnkey Line
(December 15, 2006) HORSHAM, Pa. — Dynatech Technology added the Samsung RF30 series reflow soldering systems to its offering of SM series flexible, turnkey placement systems distributed in North America. Samsung uses the RF30 series globally to assemble its own product.
Quarterly Forum Critiques OEM Strategies
(December 15, 2006) ALAMEDA, Calif.— During the Technology Forecasters Incorporated (TFI) Quarterly Forum, OEMs, EMS providers, and suppliers discussed successful approaches to outsourcing, and analyzed challenges facing OEMs and manufacturing partners. Environmental regulations such as China RoHS represented a considerable challenge without clear solutions.
Nordson Completes Dage Acquisition
(December 15, 2006) WESTLAKE, Ohio — Nordson Corporation completed acquisition of Dage Holdings, Ltd., adding the test-and-inspection company to its advanced technology systems segment.
SMTA Recognizes Top SMTAI '06 Papers
(December 14, 2006) MINNEAPOLIS, Minn. — The SMTA will award winners of best conference, proceedings, and international papers from SMTAI 2006, held in September in Rosemont, Ill. The authors will formally receive honors during the opening ceremony of SMTAI 2007 in Orlando, Fla.
IPC Develops Midwest Show
(December 14, 2006) BANNOCKBURN, Ill. — IPC — Association Connecting Electronics Industries will host the IPC Midwest Conference & Exhibition, September 23 – 28, 2007, at the Renaissance Schaumburg Hotel and Convention Center, Schaumburg, Ill. The show will focus on electronics manufacturing, announced IPC.
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