Web Exclusive Articles
Industry News |
Home Page |
Archives Home
Home Page 2006 P15
Submicron X-ray Detects Below 1 µm
(October 4, 2006) WUNSTORF, Germany — The microme|x submicron, high-resolution system from phoenix|x-ray Systems and Services enables manual and semi-automated solder joint inspection of BGAs, CSPs, MLFs, and QFPs. The X-ray inspection machine offers detail-detection below 1µm, with a total magnification of up to 13.300×.
Zuken, Rio Partner on Chip to PCB Design
(October 4, 2006) MUNICH, Germany; WESTFORD, Mass.; and YOKOHAMA, Japan — Zuken and Rio Design Automation, with some collaboration from Magma Design Automation, will work in a cooperative sales and technical development program to generate an optimized design environment from chip to package to PCB.
Realizing the Expectations of AOI
By Matthew Holzmann, Christopher Associates
With the resurgence of the electronics interconnect manufacturing industry there is renewed emphasis on AOI. Long-time users are in the market for new and improved technology, while other companies are ready to implement AOI on a wider scale. Price competition has thinned profit margins for both users and vendors, and yet AOI has still not achieved its original performance goals.
Software for Solder Inspection
The remote teaching system (RTS) reportedly enables users to program off-line, without shutting down the system during programming.
Stencil Printer Option
The Accela stencil printer has been optimized with SpeedVision, a high-speed inspection option, that can perform 2-D substrate and stencil inspection during the printing process.
No-clean Solder Paste
An improved no-clean solder paste formulated for SAC 305 leaves a shiny, aesthetically-pleasing finish on solder joints. The clear flux residue does not interfere with inspection, and the paste is said to improve wetting capabilities.
Service Notifies of Part Changes
(October 3, 2006) ROCHESTER, NY — EMA Design Automation announced the availability of products and services for component event management. Provided by PCNAlert, the offering brings end-of-life and other supply chain related notices to PCB designers.
Book-to-Bill Strong, Should Continue
(October 2, 2006) BANNOCKBURN, Ill. — The North American rigid circuit book-to-bill ratio for August 2006 rose to 1.06, while the flexible book-to-bill ratio grew to 1.05, shows a recent release from IPC — Association Connecting Electronics Industries. The combined industry book-to-bill, encompassing rigid and flex circuits, was 1.05.
Awards Recognize Industry Products
(October 2, 2006) CHICAGO — In a September 27th ceremony during SMTA International, 19 Global Technology awards were presented to companies within the electronics manufacturing industry. Attentiveness to lead-free manufacturing and assembly automation garnered specific praise.
Morey Corporation Invests in Innovation
(September 28, 2006) WOODRIDGE, Ill. — Expanding on its engineering and test capabilities, Morey Corporation will break ground on its 26,300-square-foot, two-story technical research center — the Richard R. Morey Innovation Center. The facility, which will be built in 2007, will be located adjacent to the company's headquarters.
PAGE:
1 |
2 |
3 |
4 |
5 |
6 |
7 |
8 |
9 |
10 |
11 |
12 |
13 |
14 |
15 | 16 |
17 |
18 |
19 |
20 |
21 |
22 |
23 |
24 |
25 |
26 |
27 |
28 |
29 |
30 |
31 |
32 |
33 |
34 |
35 |
36 |
37 |
38 |
39 |
40 |
41 |
42 |
43 |
44 |
45 |
46 |
47 |
48 |
49 |
50 |
51 |
52 |
53 |
54 |
55 |
56 |
57 |
58 |
|
|
|
|
Search Articles
Advanced Search
|
Current Issue 