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Epoxy Company Expands in China
(August 14, 2006) HONG KONG — Dow Epoxy, a business unit of the Dow Chemical Company, plans to invest more than $200 million in manufacturing and R&D facilities in China over the next five years. Four facilities will be either constructed or expanded in a targeted local market investment. Dow Epoxy currently operates 10 manufacturing facilities, including its Zhangjiagang, Jiangsu Province, China location.
Henkel Expands in India
(August 11, 2006) IRVINE, Calif. — The electronics group of Henkel will broaden its representation in India, increasing sales and technical personnel, as well as manufacturing capabilities. The company appointed Bhavesh Muni global director of business development in the region to manage and direct the expansion.
Cookson Technology Group Solves Assembly Issues
(August 11, 2006) JERSEY CITY, N.J. — Cookson Electronics Assembly Materials announced it has established a global applications technology and engineering group, which joins its global R&D group. This effort formally integrates the company's field engineer network knowledge base into its internal applications structure. The global technology group will help Cookson's customers in solving assembly technology, yield, and reliability problems.
DDi Invests in Core PCB Operations
(August 10, 2006) ANAHEIM, CA — DDi Corp. announced two transactions designed to boost its PCB engineering and manufacturing services — sale of their assembly business and acquisition of Sovereign Circuits, Inc., from North Jackson, Ohio. The company has also implemented a series of related changes in 2006 to improve capital structure, divest certain European operations, and refocus management.
Letters to the Editor
We often receive letters from readers regarding past editorials or features that appeared in the magazine or online. Following are just a few letters that have come into our inboxes. We want to hear from you! Let us know how we're doing — or what your company is doing. Send your letters to mboisvert@pennwell.com.
iNEMI Considers Medical Electronic Standards
(August 10, 2006) HERNDON, Va. — The International Electronics Manufacturing Initiative (iNEMI) will develop test and usage condition guidelines to assess reliability in medical devices. The Medical Components Reliability Specifications Project, organized by the consortium's Medical Technology Integration Group (TIG), is being presented to the iNEMI technical council today, August 10, 2006.
Companies Create Laser Reflow System
(August 10, 2006) LINCOLN, R.I. — The Solder Paste business group of EFD, Inc., and Leister Technologies, LLC, will cooperatively promote their automated solder paste reflow system, said to cut soldering times by nearly 80% over traditional wire and iron soldering methods.
EKRA Notes Revenue Highs, 500th Shipment
EKRA America posted its largest six-month and rolling 12-month revenues with the close of the first half of 2006. The company also announced the shipment of its 500th machine to the American market in June.
BGA-to-BGA Adapter Protects Boards
(August 8, 2006) FRENCHTOWN, N.J. — To resolve BGA soldering issues — common when lead-free solder balls reflow on a board with tin/lead BGAs — Aries Electronics produced a BGA-to-BGA adapter. The ARI-A-7277 eliminates incomplete wetting at tin/lead reflow temperatures.
From the Editor
When I began writing editorials for our twice-monthly e-newsletter, I talked about a visit I had taken to the Museum of Science in Boston, Mass., and the unnerving unwillingness of visitors to stop and smell the roses, so the speak, and learn a little something about each exhibit. Surprisingly, this fast-paced lifestyle and need for immediacy may be a benefit and strength to North American printed circuit board (PCB) manufacturers.
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