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Conductive Inks Rework the Board
By Meredith Courtemanche, assistant editor
Electrically-conductive inks challenge traditional etched or plated copper traces in circuit boards. Fast-drying and highly stable at room temperature, inks enable high-speed assembly with reduced product waste. Additional concerns, such as hazardous waste management and restrictions, as well as thermal management and cure time, determine the viability of conductive inks vs. copper traces on boards.
Shea Keynote Looks Ahead
NASHUA, N.H. — Attentive to the electronics industry's burgeoning environmental responsibility, and the challenges associated with multiple, global legislative initiatives, Dan Shea, chief technology officer (CTO), Celestica, will offer knowledge and insight in his keynote address "Cradle to Rebirth — The Electronics Industry Goes Green," on October 17, 2006, at Implementing Lead-free: A Hands-on Workshop.
Mild Cleaner Extends Contact Times
(August 9, 2006) ASHBURN, Va. — ZESTRON America introduced the VIGON A 200+, an updated VIGON product based on the company's MPC technology. The cleaning agent — specifically developed for low- and medium-pressure spray-in-air processes — allows for long exposure times without detrimental effects on materials or solder joints.
Conveyor System Cools Post-reflow
(August 8, 2006) SAN DIEGO — Eunil H.A. Americas Inc. introduced the ECV-100 Coolveyor, a cooling conveyor system for post-reflow. A cooling rate of 2°C/sec. is anticipated.
Heatsinks Cool Freescale Processors
(August 9, 2006) NORWOOD, Mass. — Two heatsink solutions, developed over the course of a year by Advanced Thermal Solutions (ATS), feature aluminum fins that exploit all available air. "Although they were originally developed for Freescale MPC 8641D dual-core processors, both are available to the open market for applications with similar thermal management requirements," said Ray Santos of ATS. The Juneau and Anchorage heatsinks are members of the Alaska line.
IPC Workshop Examines Lead-free Finishes
(August 8, 2006) BANNOCKBURN, Ill. — The IPC workshop, "Lead-free Surface Finishes and Compatibility to Lead Free Soldering: The Road to RoHS Compliance," will give attendees insights into the effect of lead-free surface finishes on solderability and reliability. Topics will include co-planarity, solder paste spreadability, thru-holes, and more. Higher solder melting points that cause heat stress and aging will also be examined.
Solder Alloy Meets Mil/Aero Requirements
(August 7, 2006) EAST SUSSEX, U.K. — SJ7 solder alloy from Almit Technology Ltd. is characterized by mechanical capabilities typical for use in military and aerospace applications. The paste offers improvements in tensile- and creep-strength properties over traditional tin/lead solders at room and elevated temperatures.
Spliceable Feeders Support High-speed Placement
(August 7, 2006) BINGHAMTON, N.Y. — The Gold spliceable tape feeders from Universal Instruments offer continuous splice capability. The feeders support high-speed chip placement machines, line-level reporting, and traceability functions.
Eunil H.A. Adds 3-D Paste Inspection System
(August 4, 2006) SAN DIEGO — The PARMI SPI HS30 3-D inline paste inspection system from Eunil H.A. Americas inspects several types of solder paste defects after screen printing by measuring height, area, and volume. Its 3-D data is said to back-up system performance for reliability and accuracy.
SMTC Notes Revenue Growth in Second Quarter
(August 4, 2006) TORONTO — SMTC Corporation released its second-quarter results, with revenue of $61.1 million and net income of $1.3 million reported, for the quarter ending July 2, 2006. This shows a rise from $57 million and a net income of $0.3 million for this quarter last year.
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