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SMT/HYBRID/PACKAGING a Success
(June 6, 2006) NUREMBURG, Germany — With 579 exhibitors, 76 represented companies, and 502 conference attendees, SMT/HYBRID/PACKAGING 2006, Nuremburg, closed on June 1st as nearly the largest SMT/HYBRID/PACKAGING show, claims conference officials.

Lead-free Solder Is No-Clean and Water Washable
(June 5, 2006) BRANFORD, Conn. — The LF-4300 from AMTECH Inc. is a RoHS-compliant, lead-free solder paste featuring multi-process capabilities for water-washable and no-clean applications.

Programming Software Raises Throughput
(June 2, 2006) HOUSTON — Featuring increased throughput on 7th-generation automated programming systems, BP Win 4.60 software from BP Microsystems can change site-sequence-prioritization routine, reportedly allowing an autohandler to pick-and-place parts economically.

Tomography System Uncovers Ancient Secrets
(June 2, 2006) HERTS, U.K. — X-Tek Systems is using its imaging equipment to uncover the use of a mysterious calculation device discovered in a shipwreck in the Greek islands. The company is using the equivalent of its body scanner to determine the secrets behind the Antikythera Mechanism, a 2,000-year-old astronomical calculation device that is possibly more advanced than any other mechanism for at least a thousand years after its manufacture in about 100 B.C.

VCXOs Offer Low Phase Noise
(June 2, 2006) MIAMI — The expanded family of RoHS-compliant, ultra-high- and high-frequency voltage-controlled crystal oscillators (VCXOs) from Raltron Electronics Corp. features low phase noise with pull up to 1,000 ppm available at some frequencies.

Conveyors Cool PCBs After Wave Soldering
(June 1, 2006) FALL RIVER, Mass. — Featuring a static-dissipative, snap-link belt with full-surface ribs to increase cooling, the Hump-back conveyor system from SmartMove Conveyors handles hot PCBs exiting a wave solder machine.

SMTAI Summit Addresses Emerging Technologies
(June 1, 2006) MINNEAPOLIS — New technologies are continuously being implemented into the electronics industry. To remain at the forefront of emerging trends, the SMTA organized the Emerging Technologies Summit, which will take place at SMTA International and Assembly Tech Expo (ATExpo), September, 24–28, 2006, in the Donald Stephens Convention Center, Rosemont, Ill.

Machine Neutrality Is Benefit of Lead-free Control Solution
(May 31, 2006) YAVNE, Israel — The TraceXpert solution from Valor Computerized Systems delivers a full lead-free environment control platform said to cover all machine makes and models.

IPC Posts April Book-to-Bill Ratio
(May 30, 2006) BANNOCKBURN, Ill. — The North American rigid PCB book-to-bill ratio for April 2006 remained positive at 1.08, while the flexible circuit book-to-bill ratio fell to 0.87. The IPC reports a combined book-to-bill ratio of 1.07 for April.

Shelf-stable Adhesive Withstands Severe Conditions
(May 30, 2006) HACKENSACK, N.J. — The Supreme 10HTFL one-component, flexible, epoxy resin-based adhesive/sealant from Master Bond features extended ambient temperature storage capabilities and an extended shelf life without refrigeration prior to use.

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