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Lead Removal System Exhibits Low Toxicity
(March 27, 2006) FRANKLIN, Mass. — A low-toxicity Lead Eliminator from JNJ Industries combines chelating agents and other ingredients to remove traces of lead and other heavy metals from work surfaces. When transitioning to lead-free electronics assembly, these traces of lead and other heavy metals may remain on workbenches and other surfaces after cleaning in and around SMT lines, creating a potential for cross contamination.

Nexlogic Expands to Larger Facility
(March 27, 2006) SAN JOSE, Calif. — Nexlogic Technologies has moved PCB design, assembly, fabrication, and procurement operations from a 11,000-square foot building to a 30,000-square-foot facility featuring new equipment and services, noting growth in servicing the medical, military/aerospace, semiconductor, and industrial markets.

In-line Router Enables High-volume Production
(March 24, 2006) OULUNSALO, Finland — The High-Speed Router from Elektrobit Group Plc separates PCB modules from the panel in high-volume production of small PCB panels. The system completes the process in grippers, ensuring short cycle times for high-volume production requirements. The router suits high-mix production due to fast set-up features and new product teaching with product drawings.

Panasonic Factory Solutions Appoints Director of Solutions
(March 23, 2006) BUFFALO GROVE, Ill. — Panasonic Factory Solutions Company of America (PFSA) has named M. Faisal Pandit as Director of Solutions to oversee all software and engineering solutions. Pandit reports directly to PFSA president Tom Gebhardt.

ESSEMTEC Hires Technical Manager
(March 23, 2006) GLASSBORO, N.J. — ESSEMTEC USA recently hired Jeffrey J. Stong as its new Technical Manager, who brings more than 22 years of experience in the electronics industry.

Products Aid Lead-free Transition
(March 22, 2006) AMARILLO, Texas — Techspray's LeadCheck (2515-N) swabs test components and solder joints for leaded solder in both existing and incoming inventories. The company's Lead-free/RoHS Guide covers issues related to defluxers, wicks, masks, soldering tips, and solder pots.

iNEMI Roadmap Workshop: One Week to Register
(March 22, 2006) HERNDON, Va. — Registration for the International Electronics Manufacturing Initiative (iNEMI)'s 2007 Roadmap workshop, to be held together with SEMICON Europa in Munich, Germany, on April 5th, closes on March 28, 2006, barring full capacity prior to the date. The full-day meeting will give attendees a first-look at draft chapters of the 2007 Roadmap, including two key market segments and eight technology and infrastructure areas the Roadmap covers.

March Plasma Launches Shanghai-based Lab
(March 21, 2006) CONCORD, Calif. — March Plasma Systems opened an advanced plasma applications and demonstration laboratory in Shanghai, China, and named Michael Zhang as Applications Field Service Engineer to oversee product training, customer demonstrations, applications development, and lab-related activities.

NEPCON China Summit Touts Lead-free
(March 21, 2006) SHANGHAI, China — NEPCON/EMT China, to take place April 4–7, 2006, in Shanghai, is an SMT-focused event that offers networking opportunities and the latest information on the newest products. Held annually, this year's show will target the lead-free transition since the looming July 1, 2006 deadline is right around the corner, giving attendees plenty of options in implementing lead-free in time.

SPECIAL FEATURE: Remote Diagnostics Offer Benefits Without IP Loss
This article focuses on a twist to remote-diagnostic maintenance technology, and the unyielding push to comfort PCB makers who have historically been concerned that sharing maintenance data with suppliers using Internet portals drilled into their fab will expose precious trade secrets. By Chakrapani "Chuck" Vallurupalli

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