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Web Exclusive Articles Industry News | Home Page | Archives Home Home Page 2006 P49 Kyzen Refutes Sale of Company (February 22, 2006) NASHVILLE, Tenn. — Following Zestron America's announcement of its intent to purchase the cleaning company, Kyzen Corporation, Kyle J. Doyel, CEO and president, refuted the claims stating, "Kyzen's board of directors has not solicited, nor has it directed management to solicit, offers from any party or have discussions regarding a potential sale of the company." Zestron Looks to Acquire Kyzen (February 22, 2006) ASHBURN, Va. — Zestron America announced its interest in purchasing Nashville, Tenn.-based Kyzen Corporation, emphasizing the company's desire to complete a negotiated transaction with the support of Kyzen's board of directors. No further details were provided, but Zestron noted the company is prepared to offer Kyzen shareholders a premium. Kyzen is expected to comment later today on this matter. Desoldering Pencil Includes Disposable Solder Trap (February 22, 2006) APEX, N.C. — The Weller DXV80 in-line desoldering pencil from Weller, which features a disposable solder trap for easy cleaning, is suitable for desoldering thru-hole components on PCBs. U.K.-based Exception PCB Predicts Flex-rigid Growth (February 22, 2006) TEWKESBURY, U.K. — Exception PCB noted growth and development in the flex-rigid market, resulting in predicted revenues of more than a million pounds in 2006. The company focuses on a 20-day turnaround on all products, with a five-day response on quickturn components. SPECIAL FEATURE: Choosing the Proper Workbench or Workstation On the surface, you might think that purchasing a workbench or workstation is a relatively simple proposition. Your employees have work to do, and they need an efficient, comfortable, and practical place in which to do it. But before you can be sure that you are getting the correct workbench, you need to perform some upfront work yourself. There are, in fact, many variables to consider. By James Anderson and Ron Santoro, product managers, Lista International 3-D LED Array Packages Offer Wide Viewing Angle (February 21, 2006) SAN FRANCISCO — Mixing high-brightness LEDs with 3-D packaging technology, TT electronics OPTEK Technology's Lednium Series 10-W LED array packages offer a full 120° viewing angle for its array of amber, blue, green, red, or white LEDs. The devices achieve an output of up to 330 lumens with nine 1-W LEDs mounted in a 1.3 in2 anodized aluminum package, with a board-mounted profile of less than .5". Universal Appoints Director of Corporate Accounts (February 21, 2006) BINGHAMTON, N.Y. — Universal has named Mark Ragard, former director of Americas operations, as its new director of corporate accounts, in which he will oversee the company's corporate accounts structure. He also will lead the development of Universal's worldwide corporate level activity and supervise the accounts of high-profile OEM and EMS clients. Zuken Unveils Web-downloadable PCB Design Solution (February 17, 2006) MUNICH and WESTFORD, Mass. — Zuken has launched its latest version of CADSTAR Express, a free Web download of the CADSTAR 8.0 desktop PCB design solution. This fully functional version of CADSTAR 8.0 features tools for design from schematics to manufacture, with a limit of 300 pins and 50 components. Cobar's New Color-coding System Distinguishes Lead-free (February 17, 2006) BREDA, Holland — The threat of cross-contamination, such as lead-bearing materials that can mix up with new lead-free solders, is a major issue facing the electronics industry. Even small amounts of lead contamination can cause tremendous problems and result in high remediation costs, as well as process downtime if they accidentally mix with lead-free soldering products. Reworkable CSP/BGA Underfill Performs in Low Temperatures (February 16, 2006) IRVINE, Calif. — Loctite 3549, a high flow underfill formulated specifically for use with advanced CSP and BGA packages, is now available from the Electronics Group of Henkel. It quickly fills the space beneath the CSP and BGA packages and cures rapidly at low temperature, minimizing thermal stress to other components on the PCB, and allowing for in-line curing to increase device throughput. PAGE: 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 | 16 | 17 | 18 | 19 | 20 | 21 | 22 | 23 | 24 | 25 | 26 | 27 | 28 | 29 | 30 | 31 | 32 | 33 | 34 | 35 | 36 | 37 | 38 | 39 | 40 | 41 | 42 | 43 | 44 | 45 | 46 | 47 | 48 | 49 | 50 | 51 | 52 | 53 | 54 | 55 | 56 | 57 | 58 |

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