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SMT Magazine Honors 2005 VISION Awards Winners
ANAHEIM, Calif. — SMT Magazine announced recipients of its 2005 VISION Awards during the 14th Annual VISION Awards ceremony and celebration, held February 8, 2006, at the Marriott Hotel in Anaheim, Calif. Nearly 300 people attended the awards ceremony and celebration.

High-density Interconnect Arrays Available
(February 15, 2006) NEW ALBANY, Ind. — The SEARAY high-density interconnects (SEAM/SEAF Series) from Samtec Inc. provide a solid grid of contacts on 1.27-mm pitch and up to 500 I/Os. A selection of solder crimps on the tails provide a choice between tin/lead alloy or RoHS-compliant, tin-only alloy for lead-free processing.

SMTA International Call for Papers Opens
(February 15, 2006) MINNEAPOLIS — The SMTA International Technical Committee has opened its Call for Papers for abstract submission for SMTA International 2006, to be held September 24–28, 2006, in Rosemont, Ill. Short course descriptions are also being solicited.

DEK's Shekou Facility Becomes ISO-certified
(February 14, 2006) SAN JOSE, Calif. — DEK's Shekou, China manufacturing facility has obtained the ISO 9001 quality management system certification, following an independent assessment by accreditation body BSI.

Cobar CEO Honored with IPC Service Award
(February 14, 2006) ANAHEIM, Calif. — Eli Westerlaken, CEO of Cobar Europe, has nabbed a Distinguished Committee Service Award by the IPC–Association Connecting Electronics Industries for his contribution to the development of the IPC standard J-STD-006B, "Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders."

IPC Honors Industry Icons with '05 Hall of Fame Award
(February 13, 2006) BANNOCKBURN, Ill. — At the APEX/IPC Printed Circuits Expo/Designers Summit exhibition and conference, held February 8–10, 2006, in Anaheim, Calif., IPC–Association Connecting Electronics Industries awarded Gene Weiner, Weiner & Associates; and Vern Solberg, Micro Electronic Engineering Services; with the 2005 Raymond E. Pritchard IPC Hall of Fame Award.

UV Cure Unit Integrates or Operates Stand-alone
(February 10, 2006) INDIANAPOLIS — Specialty Coating Systems' (SCS) Precision UVC ultraviolet (UV) cure unit offers tubular, full-spectrum UV curing in tandem with the Precisioncoat or as a stand-alone system. When coupled with the Precisioncoat or Precisioncoat EL, components move from the spray coating system to the cure unit automatically, with the coating system PC controlling the cure cycle.

EPIC Technologies Names VP of Business Development
(February 10, 2006) ROCHESTER HILLS, Mich. — EPIC Technologies has promoted Todd Baggett to vice president of business development and an officer of the Company, having previously served as director of business development.

Lead-free, No-clean Solder Paste Boosts Wetting
Heraeus' newly formed Contact Materials Division (CMD) announced the F640 series of lead-free, no-clean solder paste to promote wetting and minimize defects with tin/silver/copper alloy soldering.

Materials Science Program Addresses Reliability Concerns
When speaking with electronics assemblers, Indium Corporation of America discovered there are many challenges to overcome, including thermal management issues resulting from increased power demands and component miniaturization. Solder joint reliability was the #1 concern for assemblers, said Ross Berntson, director of solder products. In response, Indium Corporation developed its Materials Science Program for Reliability.

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