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Distinct Part Numbers Major Request at RoHS Summit
(January 26, 2006) SAN JOSE, Calif. — Last week, a group of authorized distributors, customers, component manufacturers, EMS providers, and OEMs gathered at NEDA's RoHS Summit to discuss the status of the industry six months before the July 1, 2006, RoHS deadline. One topic of concern that came up continuously was the call for distinct part numbers to ease confusion and increase accuracy.
IPC Picks Ten Companies for Innovative Technology Showcase
(January 26, 2006) BANNOCKBURN, Ill. — IPC–Association Connecting Electronics Industries announces the companies launching revolutionary technologies at this year's Innovative Technology Showcase (ITS), which will be held February 8–10, 2006, at the APEX/IPC Printed Circuits Expo/Designers Summit exhibition and conference in Anaheim, Calif.
Image Processor Software Optimized with SMT/BGA Capabilities
(January 26, 2006) SAN DIEGO — Adding to the Verifier Image Processor (VIP) Application Software series, FocalSpot introduced the VIPx, featuring an extended set of advanced SMT/BGA inspection capabilities and image enhancement tools.
Software Touts Real-time Process Monitoring for AOI
(January 26, 2006) SAN CLEMENTE, Calif. — The YESPC Software from YESTech is an enhancement from the company's automatic optical inspection (AOI) technology — providing real-time process monitoring.
Arrow Electronics Names President for North America, Asia-Pacific Components
(January 25, 2006) MELVILLE, N.Y. — Arrow Electronics, Inc. has named Michael J. Long as president of North America and Asia-Pacific Components; a promotion from his previous position as president of the company's North American businesses. The presidents of both the company's North American and Asia-Pacific components businesses will report to Long, who has 25 years of experience in electronic components and computer products distribution.
Aegis Introduces End-to-end NPI/MES Solution
(January 25, 2006) PHILADELPHIA — Aegis Industrial Software's MCAD system caters to increasing customer demand for an end-to-end NPI through MES solution supporting electronics assembly, system integration, and box build. An integral part of the greater Aegis factory information system, it supports box and mechanical product documentation, tracking, quality, and materials management. Aegis customers may now support any discrete assembly processes in a single information system.
Non-contact Surface Profiling Improves Board Quality
Confocal 3-D profiling systems can be used at any step in the fabrication or assembly process to inspect and analyze visible features on outer layers of PCBs. Unlike inline machines dedicated to post-solder and post-component placement inspection, these systems feature versatile 3-D measurement, visualization, and analysis tools used for off-line quality control and defect diagnosis.
By Ciaran Murphy, Taylor Hobson Ltd.
Universal Grows Genesis Platform Team with New Appointments
(January 24, 2006) BINGHAMTON, N.Y. — Universal Instruments has appointed a new Business Development Manager and Product Marketing Manager to the Genesis Platform Product Team, further boosting its position to compete in the evolving high-speed chip placement and flexible fine-pitch global marketplace.
Speedline Appoints Development Group Leader
(January 24, 2006) FRANKLIN, Mass. — Speedline Technologies has named Dr. Rita Mohanty to lead its Advanced Development Group (ADG), a
team of engineers and resources dedicated to the research and development of technological and process innovations in SMT manufacturing and PCB assembly.
Systems Focus on PCB/BGA Inspection
(January 23, 2006) RANDOLPH, N.J. — Two compact X-ray systems from Glenbrook Technologies, the RTX series for production monitoring and Jewel Box series for process development and failure analysis, are said to reduce manufacturing costs.
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