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Digi-Key to Distribute Samtec Products
(November 2, 2006) THIEF RIVER FALLS, Minn. And NEW ALBANY, Ind. — Digi-Key Corporation and Samtec, Inc. have signed a global distribution agreement, wherein Digi-Key will distribute Samtec's PCB-level interconnects, cable assemblies, high data rate cables, and flex assemblies.

Assembléon Nabs Long-term Deal with PPEM
(November 2, 2006) VELDHOVEN, The Netherlands — Penning an agreement totaling more than 20 million Euro, Zhengjiang Pound Precision Electronics Manufacturing Co. Ltd. (PPEM) has chosen Assembléon as a long-term production technology partner, and will use the company's single-platform, A-series pick-and-place system at its Jurong, China facility.

Fawn Electronics Rebuilds
(November 2, 2006) WILSON, N.C. — Following a fire in December 2005 that destroyed its Elm City, N.C. site, Fawn Electronics Company announced plans to build a new manufacturing site in the Nashville Business Center in Nash County, N.C.

Hitachi France Installs Valor Pre-production Suite
(November 1, 2006) YAVNE, Israel — Valor Computerized Systems installed its Trilogy 5000 pre-production engineering solution and Valor Parts Library (VPL) at Hitachi's Orleans (Loiret), France, manufacturing facility, which specializes in assembling complex boards for Hitachi computer product applications.

Trade Visit Examines China's PCB Market
(November 1, 2006) BANNOCKBURN, Ill. — IPC — Association Connecting Electronics Industries has established a trade visit to China to better understand the direction of the Chinese PCB industry, and how it will affect the global market. The mission will run in conjunction with the 2006 International Printed Circuit and Electronics Assembly Fair in Dongguan, China, December 6-8, 2006.

Lead-free Solder Wire Incorporates Polymers
(October 31, 2006) LONDONDERRY, N.H. — Cobar Solder Products, a subsidiary of Cobar Group, will offer CobarCore lead-free cored wire solder for lead-free assembly applications.

MEPTEC Keynote Predicts End to Moore's Law
(October 30, 2006) SAN JOSE, Calif. — William Bottoms, Ph.D., will keynote the MicroElectronics Packaging and Test Engineering Council (MEPTEC) symposium "IC Packaging and Test Roadmaps: Device Trends Impact on Packaging and Test Technology and Supply Chain," on November 16, 2006, in San Jose, Calif. Bottoms' keynote will accompany four focus sessions on aspects of supply chains and roadmaps.

R.I.T.'s CEMA Receives Solder System
(October 30, 2006) ROCHESTER, N.Y. — A.C.E. Production Technologies donated a KISS 102 selective soldering system to the Center for Electronics Manufacturing and Assembly (CEMA) at the Rochester Institute of Technology (R.I.T.) in Rochester, N.Y.

Handbook Specifies Design Standards
(October 30, 2006) ST. LOUIS — The second edition of Geometrical Dimensioning and Tolerancing for Design, Manufacturing, and Inspection, by Georg Henzold, covers international design standards and revisions for geometrical product specifications.

Classes Shed Light on Vision Systems
(October 30, 2006) NATICK, Mass. — Cognex Corporation will offer "Cognex University," a national, company initiative created to illustrate vision system applications through seminars, workshops, and training sessions.

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