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New Products in December
Following are the new soldering systems, cleaning materials, training resources, software programs, testers, and other electronics manufacturing products introduced by Zestron, STI Electronics, Lumex, AVX, Fujipoly, Corelis, and other companies in the electronics manufacturing supply chain.
Fitch Ratings: 2009 Concerns for U.S. Technology
(December 4, 2008) NEW YORK — Fitch Ratings put out its outlook for a majority of U.S. information technology (IT) sectors as negative for 2009. Sectors such as EMS and IT distributors will be affected by an economic downturn from a profitability standpoint, but this decline has historically been offset by working capital improvements, Fitch asserts.
Centipede, Topline Partner on Test
(December 4, 2008) SAN JOSE, Calif. — Centipede Systems, manufacturer of connectors and sockets for electrical test, is partnering with TopLine to develop a cost-effective test evaluation tool. Centipede and TopLine will produce evaluation kits for alternative contactor technologies aimed at high-performance burn-in test for semiconductor devices.
Manncorp Debuts Benchtop Production Line
(December 2, 2008) SAN DIEGO, Calif. and WILLOW GROVE, Pa. — The "Starter Lab" turnkey line from Manncorp targets low-cost precision prototyping or low-volume SMT assembly. It also is used by technical schools and colleges. The line includes a precision stencil printer, a computer-controlled pick-and-place unit and a lead-free reflow oven.
Research Report: EMS Rankings in Europe
(December 2, 2008) MONTREAL — Electronics.ca Publications released "The European EMS Industry: An Analysis of the Top 50 European EMS Providers," providing an overview of the major European EMS providers. The report serves companies across the electronics supply chain including industry analysts from the financial, management, and government sectors.
Participate in APEX 2009
(December 1, 2008) BANNOCKBURN, Ill. — IPC — Association Connecting Electronics Industries is inviting researchers, academics, technical experts, and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO, March 31 to April 2, 2009, in Las Vegas. Online registration to attend the conference and expo is now open at www.ipcapexexpo.org.
Saki To Acquire MacroScience to Expand AOI and X-ray
(December 1, 2008) Japan and Hong Kong — Japanese AOI manufacturer Saki Corporation signed a sale and purchase agreement with Schmidt Electronics, an Asia-Pacific conglomerate of advanced electronics and IT technology, acquiring a percentage in MacroScience Technology Limited (MSTL). Saki hopes to add X-ray technology to its inspection portfolio via the acquisition.
Henderson Evaluates Computer Sector
(December 1, 2008) LOS ALTOS, Calif. — Modest PC prospects are forecast for 2009, according to the Henderson Forecast Summary from Henderson Ventures. The analyst firm also sees falling average selling prices (ASPs) as one reason for shrinking computer revenues in 2009.
Reducing and Preventing Tin Corrosion Whiskers
By Olaf Kurtz, Ph.D.; Peter Kühlkamp; Jürgen Barthelmes; and Robert Rüther, Atotech Deutschland GmbH
For the connector and IC/leadframe industries, corrosion can occur on metalized components and products, resulting in malfunctions. This article presents the work done on an effective anti-corrosion treatment* that can mitigate corrosion whisker formation effectively. Process benefits to tin solderability are highlighted.
Embedded Packaging Comes of Age
By Risto Tuominen, Imbera Electronics
The demand for improved functionality within smaller spaces in the electronics arena is straining existing semiconductor and SiP packaging technologies. Several novel technology approaches are being developed to increase product miniaturization and performance. During recent years, component embedding inside PCB motherboards and substrates has generated a lot of attention and is seen as one of the most promising technology solutions for future.
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