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Names in the News
Following are the distribution, promotion, and expansion announcements from ECD, Matheson Tri-Gas, Photo Stencil, PDR, Adept, AIM, Cognex, Mouser, Rogers, Indium, and IPC.

Cookson Launches NPI Stencils Initiative
(June 19, 2008) SOUTH PLAINFIELD, N.J. — Cookson Electronics Assembly Materials is launching its "First-Time-Right" new product introduction (NPI) stencils Initiative for ALPHA "Engineered Products." The stencil product line will target assemblers and prototyping houses aiming to reduce their NPI cycle times.

Hot Topics: Solving an Industry Dilemma with Emerging Technologies
"There are practical limits to both tin/lead and lead-free solder," says Joe Fjelstad, Verdant Electronics, in his argument for solderless assembly, "Dealing with the Lead-free Challenge." Arthur Chait, EoPlex Technologies, says "today's devices demand increasingly complex components, smaller," in his exploration of emerging deposition technologies, "Keeping Pace with Miniaturization."

Report: Global Portable Electronics
(June 19, 2008) MONTREAL — Continuous technological development, digital options, and declining price points are among reasons for the growth of portable electronic products globally, according to "Global Portable Electronics Market," by Electronics.ca Publications.

Don't Leave Succession Planning to Luck
By Gary A. Tanel, Associate Equity
When an entrepreneur starts an EMS company, the last thing on their mind might be how they plan to exit the business. Successful businessmen and investors know, however, that you never get into a business without knowing how to exit. All private business ownership is transitioned one way or the other.

Teknek Opens Design Firm
(June 18, 2008) RENFREWSHIRE, Scotland — Teknek is setting up a product design company, Meso, which will be operated and overseen by two Glasgow School of Art graduates.

Live from Orlando: Freescale's Technology Forum
On Monday, I arrived in Orlando to attend the Freescale Technology Forum Americas, where the JW Marriott and Ritz Carlton Conference Center had been transformed into a Freescale Semiconductor facility for the next four days.

Manncorp Updates Benchtop Stencil Printer
(June 17, 2008) SAN DIEGO, Calif. and WILLOW GROVE, Pa. — Manncorp debuted an improved version of its Model 5500 benchtop stencil printer, which includes true vertical separation of the stencil from the PCB prior to the lifting of the stencil frame, designed for ultra-fine-pitch solder paste printing.

Agilent Intros High-density Matrix Modules
(June 17, 2008) SANTA CLARA, Calif. — Agilent launched new modules for its 34980A multifunction switch/measure unit. They are designed for aerospace/defense, consumer electronics, computers and peripherals, communications, semiconductor, and automotive industries routing low-frequency signals between stimulus, DUT, and measurement equipment when designing high-pin-count tests.

Exhibits Spotlight: NEW
National Electronics Week (NEW) takes place in London this week, with exhibitors from global locales bringing new equipment and processes to the U.K. market. Following are the new cleaning systems, reflow ovens, print platforms, solder materials, and other elements on display at the show.

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