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Balver Zinn Offers Cobar Lineup in Germany
(May 30, 2008) BREDA, Holland — Cobar solder paste, fluxes, other soldering chemicals, as well as technical support, are now available directly through the Balve, Germany, installation of its parent company, Josef Jost GmbH & Co.KG (Balver Zinn), in addition to Cobar Europe's existing distribution network.
Choosing the Most Appropriate AOI System:
Clarifying Common Misconceptions
By James Gibson, Landrex Technologies Inc. and Pamela Lipson, Ph.D., Imagen Incorporated
All AOI systems have features and characteristics in common; it's what they don't have in common that can make the difference between choosing the correct one for current and anticipated applications, and making an expensive error. Misconceptions about AOI systems can be costly in many ways. This article examines and debunks some common myths.
SMTAI Hits Both U.S. Coasts
(May 29, 2008) MINNEAPOLIS — The SMTA will bring its SMTA International Conference and Exhibition (SMTAI) to San Diego, Calif., October 4–8, in 2009, moving from the 2008 Orlando location. The plan for the immediate future will be to alternate SMTAI between the East and West Coasts.
JTAG Releases ICT-integration Module
(May 29, 2008) EINDHOVEN, The Netherlands — JTAG Technologies, an Aeroflex technology partner, launched the JT 2147/AGP boundary-scan interface for use with Aeroflex high-performance in-circuit test (ICT) platforms.
April Book-to-Bill Continues Positive Track
(May 27, 2008) BANNOCKBURN, Ill. — IPC's combined (rigid and flex) industry book-to-bill ratio reached 1.01 in April 2008, representing a steady positive in 2008, which began in January with a 0.97 book-to-bill ratio. The book-to-bill numbers are holding steady at a higher level than 2007, confirmed Denny McGuirk, IPC president.
NEPCON Tradeshows Begin in Vietnam
(May 27, 2008) BANGKOK, Thailand — In early May, Reed Tradex, a member of Reed Exhibitions, opened the first NEPCON event in Vietnam, joining the series of NEPCON events in Asia. NEPCON Vietnam is purported to be the country's only electronics manufacturing technology trade exhibition and conference.
Product Showcase: SMT/HYBRID/PACKAGING
SMT/HYBRID/PACKAGING will take place June 3 through 5 in Nuremburg, Germany, highlighting new products and processes on the European electronics assembly stage. This year's show features cleaning processes, pick-and-place systems, reflow ovens and profilers, solder, automated tooling, device programming systems, dummy components, inspection systems, and more.
Names in the News
From social networking and Website updates to personnel appointments and board memberships, companies in the electronics community are integrating person-to-person and technological outreach. Many announced contract wins and supplier awards as well. Following are the announcements from SchmartBoard and Wyndstorm, Promation, Valor, Zuken, Mara Technologies and Assembléon, STI Electronics, CAC Inc. and LCOA, Digi-Key, Avnet, Intel, Everett Charles Technologies, and Pulse.
Flex Circuit Update
By Thomas H. Stearns, Brander International Consultants
In the March 2008 SMT, an article on flex circuits highlighted liquid crystal polymer (LCP) films and the applications where they are preferred. This column offers comments on materials choice and market effects in flexible printed circuitry (FPC) in response to the March report, along with fundamental information about the FPC process.
DEK Upgrades Horizon Family
(May 23, 2008) WEYMOUTH, U.K. — DEK released a host of performance and productivity improvements across its entire Horizon product line. Upgrades affect accuracy, verification, and productivity, according to the company.
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