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The BGA/QFN Repair Process By William E. Coleman, Ph.D., Photo Stencil
Repairing a PCB with a defective BGA, micro-BGA, or QFN often is a challenging and tedious task. The conventional method is to remove the defective device, clean the pads on the PCB, then print solder paste on the pads with a mini-stencil. The stencil footprint must be small enough to fit into the area of the removed part. An alternative repair method is to print solder paste directly onto the QFN pads or BGA solder balls.
Names in the News Following are the happenings in industry and associations from the U.S. to China. Kyzen highlights lead-free cleaning at SMTA Atlanta; Distron expanded its partnership with Aegis; SMTA China augmented its Board; and Nihon Superior will examine tin and silver's roles in lead-free solder during the International Tin Conference in Hong Kong.
SMT Hosts Packaging Panel at SMTAI ORLANDO, Fla. SMT Magazine will host a panel on 3D stacked packages, August 20, 2008, during SMTA International (SMTAI) in Orlando. The panel, "3D Stacked Packages: Which Way to Go?" will debate the drivers pushing innovative, small, cost-effective 3D IC concepts with through-silicon via (TSV) interconnects. Panelists from the industry, academia, and analyst firms will present and field questions on the topic.
SMT China Hosts 2ndVISION Awards (April 10, 2008) SHANGHAI, China "China, despite the competition from neighborhood countries, appreciation of the RMB, tightening of government regulations; China's GDP is still growing at double digits," said Adonis Mak, group publisher, SMT China, during the magazine's presentation of its second annual VISION awards at Nepcon China. Winners received honors in SMT equipment, excellence in a specific metric, and China-centric awards. Following are the winners.
HP Consolidates Facilities Globally (April 10, 2008) PALO ALTO, Calif. HP will implement a major consolidation of facilities and security vendors for most of its worldwide facilities. This is expected to save tens of millions of dollars over the life of the new contracts, according to HP representatives.
From the Editor: APEX in a Nutshell For those of you who didn't make the trip to Last Vegas this year to attend APEX (March 29 through April 3), you really missed out on an important event. Here's what happened during APEX, in a nutshell.
Nepcon China Kicks Off in Shanghai (April 8, 2008) SHANGHAI, China Nepcon China, April 811 in Shanghai, will feature China-based and international exhibitors targeting the evolving Asia manufacturing base. Traditional low-mix/high-volume, medium- to high-mix/high-volume, and test-and-inspection are the focus of many exhibitors in this market. Following are some top products to look for at the show.
Moscow Event Draws International Exhibitors (April 8, 2008) MOSCOW ExpoElectronica exhibition and conference will take place April 1518, 2008, in Moscow. ExpoElectronica is an officially audited tradeshow targeting electronics assembly operation in Russia and Eastern Europe. The show drew exhibitors from 21 countries in 2007. Following are some of the product highlights for the 2008 event.
Mentor, Agilent Pair Up for RF Design (April 7, 2008) WILSONVILLE, Ore. and SANTA CLARA, Calif. PCB design tool provider Mentor Graphics Corp. and Agilent Technologies Inc. jointly developed an RF design solution to improve productivity for the design of RF circuits on PCBs. The partnership targets shorter PCB design cycle times with increased collaboration, particularly in mixed-technology designs, which incorporate RF, analog, and digital components.
From the Show: IPC News Wraps Up APEX (April 4, 2008) LAS VEGAS IPC Printed Circuits Expo/APEX/Designers Summit, this week in Las Vegas, provided an international platform for diverse launches in technology, collaborations, and products. IPC also unveiled several initiatives and awards at the show, including a joint symposium with the SMTA, volunteer and corporate honors, and best papers. APEX 2008 has come to a successful close, and IPC will return the show to Las Vegas in 2009.
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