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February Book-to-Bill Rises to 0.99
(March 27, 2008) BANNOCKBURN, Ill. — IPC — Association Connecting Electronics Industries found that the February book-to-bill ratio for rigid and flex PCBs rose to 0.99, near parity. A rise in rigid PCB bookings drove the increase from 0.97 in January.
Cookson Launches Low-silver Alloy
(March 27, 2008) PROVIDENCE, R.I. — Cookson Electronics launched ALPHA SACX 0807 globally, targeting SAC305-type performance on complex dual-sided assemblies. The alloy's strength is good wetting and high mechanical reliability, according to company representatives. It is designed to expand on the ALPHA SACX 0307 low-silver wave alloy.
Siemens EA Update: Carve Out Planned
(March 27, 2008) MUNICH, Germany — As part of its ongoing portfolio restructuring, Siemens will "carve out" its Electronics Assembly Systems (EA) business unit and turn it into a legally independent subsidiary of its Drive Technologies Division (DT), according to Klaus Helmrich, CEO, DT; and Güenter Lauber, EA's leader. Besides a spin-off, Siemens also is considering other options such as a joint venture with another successful company in the electronics industry.
Names in the News
Companies are updating, upgrading, and doing outreach on the ground, in management and branding, and on the Internet. Following are the announcements made by PROMATION, Kyzen, PCB Matrix, Inovaxe, FIT, MtronPTI and DSCC, and Stencils Unlimited and LPKF.
IPC APEX Product Preview
The IPC Printed Circuits Expo/APEX/Designers Summit will take place April 1–3 in Las Vegas. Following are more product previews for the event, including dispense system, squeegee tooling, fluxers, test systems, rework tools, machine updates, microscopes, cleaners, and other materials, equipment, and software for the electronics assembly market.
From the Editor:
Innovation Still Alive and Well in the U.S.
They say that innovation has dwindled down in the U.S., that technology and manufacturing drifted off to lower-cost providers in distant underdeveloped countries. This undeniably has happened in the contract assembly of surface mounted PCBs. It's almost as if the U.S. needs a challenge at times to get us started along another route. For instance, consider the approach we have taken to the standard 63/37 tin/lead solder paste, eutectic at 183°C, and a known entity that works well.
Technical Highlights: APEX
(March 25, 2008) LAS VEGAS — Technical presentations will take center stage at IPC Printed Circuits Expo/APEX/Designers Summit, April 1–3 in Las Vegas. Following are previews of select presentations taking place at the show, as well as links to other aspects of the technical program.
Q&A with a Turnkey EMS Provider
EPE Corporation is a 110-person turnkey EMS provider in Manchester, N.H. They specialize in domestic solutions, with high-mix and low- to medium-volume production runs. In addition to SMT, thru-hole, and BGA placement, the company performs conformal coating and UV inspection, and can incorporate custom parts. Their facility is ISO 9001-2000 certified and IPC-verified for lead-free and leaded processes. SMT spoke with Heather L. Steck-Yeaton, business development manager.
Agilent Launches Blended Test Technology
(March 24, 2008) SANTA CLARA, Calif. — Agilent Technologies Inc. will demonstrate a hybrid boundary scan and VTEP vectorless test solution, Cover-Extend, at APEX in Las Vegas, April 1–3 and Nepcon China in Shanghai, April 8–11, launching under its VTEP v2.0 Powered suite. Cover-Extend technology allows in-circuit test (ICT) without physical test points, recovering up to 50% of test node access and protecting assemblies.
Siemens Divests Electronics
(March 21, 2008) FRANKFURT, Germany — Thomson Financial reports that a spokesman for Siemens AG confirmed the company's plans to divest its electronic assembly systems unit by the end of this year. EA makes assembly machines for electronic components and circuit boards.
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