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Web Exclusive Articles Industry News | Home Page | Archives Home Home Page 2008 P8 Christopher Associates Releases HDI Market Data (October 13, 2008) SANTA ANA, Calif. — Matthew Holzmann, president of Christopher Associates, presented the keynote address to the IPC's HDI Technology Conference in Dallas, Texas, on the demand for high-density interconnect substrates in North America. With assistance from multiple sources, including Prismark Partners, Holzmann outlined existing and potential markets as well as current market conditions for these products. The major points of Holzmann's keynote are summarized here. Preview the Upcoming Mexitrónica Show (October 13, 2008) GUADALAJARA, Mexico — Mexico's National Chamber for Electronics, Telecommunication, and IT Industries (CANIETI) in partnership with ROC Exhibitions Inc. will present Mexitrónica, October 21–23, 2008, at Guadalajara, Mexico. The exposition and conference drew more than 6,000 attendees in 2007. Following are some of the highlights for the conference and show floor. From the Editor: EMS Trends Cosponsoring the A-Line at IPC Midwest gave me a unique insight into the amount of work that goes into every PCB assembly manufactured. To dig deeper, I chaired a panel of EMS providers on keeping lines running efficiently and keeping OEM customers on track and happy, for product development, NPI, manufacturing, and program management. Concise, efficient, and resourceful. What else would you expect from this industry? Scan & Design PCB Reverse Engineering Firm Hands Business Over to Photodata (October 10, 2008) BRIGHTON and HITCHIN, U.K. — Scan & Design of southern England will transition its business assets and customers to Photodata Test Services Ltd. at the end of this month. The company is closing after more than 10 years providing PCB scanning for reverse engineering of bare boards to CAD databases. Events around the Industry Newark will host an online networking and educational event on energy-efficient electronics; SMTA released the final program for Pan Pac 2009; and IPC announced an all-academic poster competition to take place at IPC APEX EXPO. Association News IPC released power conversion standard IPC-9592; the ESD Association (ESDA) elected board members and officers for 2009; and SMTA is looking for papers for its 6th annual Medical Electronics Symposium. Part 3: PCB Designer's Notebook: IC Component Package Evolution and the Impact of Lead-free Soldering By Vern Solberg Although the majority of ICs in use today are SO and fine-pitch leaded devices, many new product offerings are furnished without leads. Another shift is the move to lead-free board assembly. Will part numbers of components that are in compliance with RoHS change? Thermal Gradient Adhesion Testing By Paul Berry, Dow Corning Electronics Fast time-to-market launch plans and a constant squeeze on sales margins often exert pressure on the material evaluation process. Test methods that both quickly and accurately demonstrate an adhesive's performance on a variety of potential substrates are being developed. One method allows rapid and efficient testing of board-level adhesives over a gradient temperature profile. Study Shows Flip Chip and WLP Growth (October 7, 2008) AUSTIN, Texas — The growth of flip chip and wafer-level packaging (WLP) is a bright spot in the electronics industry, according to TechSearch International's recently released study, "2008 Flip Chip and WLP Market Trends and Forecasts." The study projects a compound growth rate of more than 14% for flip chip units and 14% for WLPs between 2007 and 2012. Names in the News Following are the business expansion, distributor signing, personnel addition, and other news stories from suppliers, EMS providers, and other companies in the electronics assembly arena. Announcements come from Optimal, FCT Solder, Indium, Mouser, IMS, and many other companies. PAGE: 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 | 16 | 17 | 18 | 19 | 20 | 21 | 22 | 23 | 24 | 25 | 26 | 27 | 28 | 29 | 30 | 31 | 32 | 33 | 34 | 35 | 36 | 37 | 38 | 39 | 40 | 41 | 42 | 43 | 44 | 45 | 46 | 47 | 48 | 49 |

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