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Circuit Board Protection Without Compromise: Why Proper Materials Selection and Compatibility are Essential for Conformal Coating Success With numerous potential applications and a plethora of formulations from which to choose, it is often difficult to know how to select ... (03/14/2008, Henkel Corporation)

Recently Added White Papers

Circuit Board Protection Without Compromise: Why Proper Materials Selection and Compatibility are Essential for Conformal Coating Success
With numerous potential applications and a plethora of formulations from which to choose, it is often difficult to know how to select the best conformal coating for the job.
(03/14/2008, Henkel Corporation)

Providing Stability in Challenging Environments - New Silicone Material Does the Trick
Connecting and disconnecting control boards. Plugging and unplugging cables into computers. Constant vibration onboard automotive modules and construction equipment. All of these ...
(02/12/2008, Henkel Corporation)

Emerging Package- On-Package Configurations Demand Sophisticated
Use of package-on-package (POP) technology is moving quickly into mainstream manufacturing: arguably, much faster than anyone would have predicted.
(12/06/2007, Henkel Corporation)

Minimizing Voiding in Lead Free Array Components
The topic of voids in lead free alloys and their effect on reliability, causes and classification has been extensively debated.
(10/30/2007, Henkel Corporation)

Thermal Solutions Take the Heat Off, Whatever the Application
When it comes to addressing the thermal management demands of today’s advanced electronics devices, there is no “one size fits all” solution.
(10/05/2007, Henkel Corporation)

Investigation of the Lead-free Solder Joint Shear Performance
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of solder joint.
(09/24/2007, Henkel Corporation)

Need a Fast, Simple BGA and CSP Support Alternative? Get the Edge from Henkel.
Although Cornerbond is one of the most cost-effective, high reliability underfill systems available for mobile devices, there is another alternative for manufacturers who want to apply ...
(06/29/2007, Henkel Corporation)

Increased Use of QFNs Brings New Challenges to Light by Brian Toleno, the electronics group of Henkel
The never-ending quest to jam even more functionality into smaller and smaller packages has increased the popularity of yet another high performance device that is quickly gaining ...
(05/03/2007, Henkel Corporation)

The Next Big Thing: Self-Aligning, Pb-free Capable Corner Support for CSPs By Brian Toleno, the electronics group of Henkel
In previous writings, I have outlined the case for the use of underfills to enhance CSP support and reduce device stress. While these materials were originally designed to accommodate ...
(04/02/2007, Henkel Corporation)

Cost-Effective CSP Support
The fact that trimming even pennies per assembly can have a very large impact on manufacturer profitability and, in the case of EMS firms, may be the difference between winning or ...
(02/19/2007, Henkel Corporation)

Webcasts RoHS Lead-free Electronics Manufacturing Original broadcast on October 3, 2007 Reliable Soldering: How to Handle the Latest Paste and Equipment Challenges Original broadcast on May 23, 2007 Sponsored by: ACE Production Technologies, BTU and Vitronics-Soltec Soldering Across the Board: Wave, Selective, and Convection Soldering Original broadcast on January 10, 2007 Sponsored White Papers Library Recently Added White Papers Circuit Board Protection Without Compromise: Why Proper Materials Selection and Compatibility are Essential for Conformal Coating Success (03/14/2008, Henkel Corporation) Providing Stability in Challenging Environments - New Silicone Material Does the Trick (02/12/2008, Henkel Corporation) Featured White Papers Circuit Board Protection Without Compromise: Why Proper Materials Selection and Compatibility are Essential for Conformal Coating Success (03/14/2008)